|
|
| Line 334: |
Line 334: |
| |[[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding |Etch/DryEtchProcessing/Bonding]] | | |[[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding |Etch/DryEtchProcessing/Bonding]] |
| |Temporary bonding of wafers or chips for dry etching | | |Temporary bonding of wafers or chips for dry etching |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Characterize your sample.png|x100px|Characterize your sample]] Characterize your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !What do you need to measure?
| |
| !Technique/Method
| |
| |-
| |
| |rowspan="12" valign="top"|[[Specific Process Knowledge/Characterization|Characterization]]
| |
| |Sample Imaging, XY dimensions
| |
| |Microscopy: optical, SEM, AFM
| |
| |-
| |
| |Sample Topography
| |
| |AFM, Profiling with stylus or optical
| |
| |-
| |
| |Film thickness and optical constants
| |
| |Ellipsometry, Reflectometry, Prism Coupling
| |
| |-
| |
| |Film Stress
| |
| |Profiling with stylus or optical
| |
| |-
| |
| |Wafer thickness
| |
| |Micrometer gauge
| |
| |-
| |
| |Element analysis
| |
| |XPS, EDX, SIMS
| |
| |-
| |
| |Contact Angle
| |
| |Drop shape analyzing
| |
| |-
| |
| |Resistivity
| |
| |Four point probe, Probe station
| |
| |-
| |
| |Doping level/Carrier density
| |
| |ECV (Electrochemical Capacitance-Voltage) -profiler
| |
| |-
| |
| |Direct Bandgap
| |
| |Photoluminescence
| |
| |-
| |
| |Lattice mismatch
| |
| |X-ray diffractometer
| |
| |-
| |
| |Defects/contamination
| |
| |Particle/defect counter
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Pack your sample (back-end).png|x100px|Pack your sample (back-end)]] Pack your sample (back-end)
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| |-
| |
| |rowspan="3" valign="top"|[[Specific Process Knowledge/Back-end processing|Back-end processing]]
| |
| |Chip/die mounting
| |
| |-
| |
| |Wire bonding
| |
| |-
| |
| |Dicing
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | Process flow examples
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Topic
| |
| |-
| |
| |[[LabAdviser/Introduction_to_LabAdviser_and_Processing|Introduction to LabAdviser and Processing]]
| |
| |Solar cell flow
| |
| |-
| |
| |[[Process_flow_approval|Process flow approval]]
| |
| |Info on process flow review
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/UVLithography#Resist Overview|UV Lithography#Resist Overview]]
| |
| |UV Lithography flows
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/EBeamLithography#E-beam resists and Process Flows|EBeamLithography#E-beam resists and Process Flows]]
| |
| |E-beam lithography flows
| |
| |- | | |- |
| |} | | |} |
