Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*HMDS priming | *HMDS priming | ||
*Spin coating of anisole based E-beam resists | *Spin coating of anisole based E-beam resists | ||
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!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
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* AR-P 6200.09 (CSAR) | * AR-P 6200.09 (CSAR) | ||
* AZ 5214E | * AZ 5214E | ||
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|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
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* AR-P 6200.09 (CSAR): 170-500 nm | * AR-P 6200.09 (CSAR): 170-500 nm | ||
* AZ 5214E: 1.5-5 µm | * AZ 5214E: 1.5-5 µm | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
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* 50 mm wafers | * 50 mm wafers | ||
* 100 mm wafers | * 100 mm wafers | ||