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Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|Spin Coater: Süss Stepper]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
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**AZ nLOF 2020
**AZ nLOF 2020
**AZ 5214E
**AZ 5214E
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**BARC (DUV42S-6)
**KRF M230Y
**KRF M35G
**UVN2300-0.8
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*In-line substrate HMDS priming
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Vacuum handling and detection
* Vacuum spin chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Cassette-to-cassette
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* AZ 5214E resist
* AZ 5214E resist
* PGMEA solvent for backside rinse and spinner bowl cleaning
* PGMEA solvent for backside rinse and spinner bowl cleaning
|style="background:WhiteSmoke; color:black"|
* DUV42S-6 (BARC)
* KRF M230Y resist
* KRF M35G resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AR-P 6200.09 (CSAR) for 2", 4", and 6"
* AR-P 6200.09 (CSAR) for 2", 4", and 6"
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* no manual dispense
* no manual dispense
* syringe dispense (60cc) of PGMEA-based resist
* syringe dispense (60cc) of PGMEA-based resist
|style="background:WhiteSmoke; color:black"|
* no manual dispense
* syringe dispense (60cc) of PGMEA and anisole-based resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* no manual dispense
* no manual dispense
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
*10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 6000 rpm
*10 - 6000 rpm
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|-
|-
|style="background:LightGrey; color:black"|Gyrset
|style="background:LightGrey; color:black"|Gyrset
|style="background:WhiteSmoke; color:black"|
*no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
*no
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:LightGrey; color:black"|Substrate  size
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*150 mm wafers
*200 mm wafers
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*50 mm wafers (tool change required)
*50 mm wafers (tool change required)
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|-
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 25
*1 - 25
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|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon  
*Silicon  
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