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Revision as of 10:45, 25 February 2015
2nd Level - Process Topic
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction
Overview of sample processing 3
Clean your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Wafer cleaning
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Soap Sonic
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Removes dust and particles
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7-up & Piranha
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Removes organics and alkali ions
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RCA
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Two step process to remove organics and metals
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5% HF
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Removes native oxide
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IMEC
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Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
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Dry your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Wafer and sample drying
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Spin dryers
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Whole wafers
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Critial point dryer
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Sensitive wafers
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process/Oxidation
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Thermal oxidation
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Thermal SiO2
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Thin film deposition
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Sputter deposition
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Si,SiO2,Si3N3,TiO2, metals
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Thermal evaporation
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Al, ?
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E-beam evaporation
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Metals
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LPCVD
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Si3N4, SRN, SiO2, Si (poly and amorph)
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PECVD
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Si3N4, SiO2, PBSG
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Electroplating
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Ni
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Lithography/Coaters
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Spin coating
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resists, polymers
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Spray coating
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resists, polymers
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Epitaxial growth
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MOCVD
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?
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process
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Annealing
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Si, PECVD layers
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Oxidation
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Si wafers
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Doping with B/P
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Si wafers
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Pyrolysis
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Resists?
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Entry page in LabAdviser
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Techniques
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Lithography
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Photolithography
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Deep UV lithography
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E-beam lithography
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Imprinting
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Entry page in LabAdviser
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Techniques
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Materials
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Etch
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Wet etch
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Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
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Dry etch
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Any material
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Lift-off
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?
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Imprinting
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LASER machining
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Lithographic definition
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Polymer Injection molding
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Entry page in LabAdviser
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Techniques
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Materials
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Entry page in LabAdviser
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Techniques
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Materials
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Chip/die mounting
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Wire bonding
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Dicing
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