Specific Process Knowledge: Difference between revisions
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|rowspan="5" valign="top"| [[Specific Process Knowledge/Doping|Doping]] | |rowspan="5" valign="top"| [[Specific Process Knowledge/Doping|Doping]] | ||
|Ion implant | |Ion implant | ||
| | |e.g. P, B, As | ||
|- | |- | ||
|[[Specific Process Knowledge/Thin film deposition/PECVD| PECVD]] | |[[Specific Process Knowledge/Thin film deposition/PECVD| PECVD]] | ||
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[[Specific Process Knowledge/Lithography/Baking| Lithography/Baking]] <br> | [[Specific Process Knowledge/Lithography/Baking| Lithography/Baking]] <br> | ||
|Baking (<300dg) | |Baking (<300dg) | ||
|baking resist and polymers | |baking resist and polymers | ||