Specific Process Knowledge: Difference between revisions
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|[[Specific Process Knowledge/Thermal Process|Thermal Process]] | |[[Specific Process Knowledge/Thermal Process|Thermal Process]] | ||
|Annealing | |Annealing (>500C) | ||
|Si, PECVD layers | |Si, PECVD layers | ||
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|Rapid Thermal Anneal (RTP) | |Rapid Thermal Anneal (RTP) | ||
|? | |? | ||
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|? | |||
|BCB curing | |||
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|Baking (<300dg) | |||
|baking resist and polymers, wafer removal | |||
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