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| ==Overview of sample processing== | | ==Overview of sample processing== |
| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Clean the sample [[File:cleaning.jpg|50px]]
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Drying Samples [[File:drying.jpg|50px]]
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Make a layer on the sample or Film Formation [[File:Making a layer 1.jpg|40px]]
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| |-
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| |Thermal Oxide growth
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| |-
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| |Physical Vapour Deposition
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| |-
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| |Sputter deposition
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| |-
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| |Thermal deposition
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| |-
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| |E-beam evaporation
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| |-
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| |CVD
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| |-
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| |LPCVD
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| |-
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| |PECVD
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| |-
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| |Coating
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| |-
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| |Spin coating
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| |-
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| |Spray coating
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| |-
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| |Electroplating
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| |-
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| |Epitaxial growth
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| |-
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]]
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Make a mask on the sample [[File:Making a mask 1.jpg|40px]]
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| |-
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| |Lithography
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| |-
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| |Imprinting
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| |-
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Transfer pattern into the sample
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| |-
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| |Wet etch
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| |-
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| |Dry etch
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| |-
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| |Lift-off
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| |-
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Direct structure definition
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| |-
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| |Imprinting
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| |-
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| |LASER machining
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| |-
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| |Lithographic definition
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| |-
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| |Polymer Injection molding
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| |-
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Bonding samples together
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Characterize the sample
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Back end of the sample
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| |-
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| |Chip/die mounting
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| |-
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| |Wire bonding
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| |-
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| |Dicing
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| |-
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| |}
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| ==Overview of sample processing 2== | | ==Overview of sample processing 2== |
