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Specific Process Knowledge/Lithography: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Line 27: Line 27:
|Pattern transfer via UltraViolet (UV) light
|Pattern transfer via UltraViolet (UV) light
|Pattern transfer via DeepUltraViolet (DUV) light
|Pattern transfer via DeepUltraViolet (DUV) light
|Pattern transfer via electron beam
|Direct writing via electron beam
|Pattern transfer via hot embossing(HE)
|Pattern transfer via hot embossing(HE)
|Pattern transfer via direct writing
|Direct writing via IR laser
|-
|-


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