Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
| Line 20: | Line 20: | ||
|'''Technical reports''' | |'''Technical reports''' | ||
|'''[[Specific_Process_Knowledge/Lithography/Coaters|Spin Coating]]''' | |'''[[Specific_Process_Knowledge/Lithography/Coaters|Spin Coating]]''' | ||
|'''[[Specific_Process_Knowledge/Lithography/Development| | |'''[[Specific_Process_Knowledge/Lithography/Development|Developer]]''' | ||
|'''Rinse''' | |'''Rinse''' | ||
|'''Remover''' | |'''Remover''' | ||
| Line 31: | Line 31: | ||
|'''AZ5214E''' | |'''AZ5214E''' | ||
|Positive | |Positive | ||
| | |AZ Electronic Materials | ||
| | |Can be used for both positive and reverse processes with resist thickness between 1 to 4um. | ||
|[[media:AZ5214E.pdf|AZ5214E.pdf]] | |[[media:AZ5214E.pdf|AZ5214E.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]] | |[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]] | ||
| | |351B developer | ||
| | |DI water | ||
| | |Acetone | ||
| | | | ||
| Line 45: | Line 45: | ||
|'''AZ4562''' | |'''AZ4562''' | ||
|Positive | |Positive | ||
| | |AZ Electronic Materials | ||
| | |For process with resist thickness between 6 and 25um. | ||
|[[media:AZ4500.pdf|AZ4500.pdf]] | |[[media:AZ4500.pdf|AZ4500.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]] | |[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]] | ||
| | |351B developer | ||
| | |DI water | ||
| | |Acetone | ||
| | | | ||
| Line 58: | Line 58: | ||
|'''AZ MiR 701''' | |'''AZ MiR 701''' | ||
|Positive | |Positive | ||
| | |AZ Electronic Materials | ||
| | |High selectivity for dry etch. | ||
|[[media:AZ_MiR_701.pdf|AZ_MiR_701.pdf]] | |[[media:AZ_MiR_701.pdf|AZ_MiR_701.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | |[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | ||
| | |AZ 726 MIF developer | ||
| | |DI water | ||
| | |Remover 1165 | ||
|[[media:Process_Flow_AZ_MiR701.docx|Process_Flow_AZ_MiR701.docx]] | |[[media:Process_Flow_AZ_MiR701.docx|Process_Flow_AZ_MiR701.docx]] | ||
| Line 71: | Line 71: | ||
|'''AZ nLOF 2020''' | |'''AZ nLOF 2020''' | ||
|Negative | |Negative | ||
| | |AZ Electronic Materials | ||
| | | | ||
|[[media:AZ_nLOF_2020.pdf|AZ_nLOF_2020.pdf]] | |[[media:AZ_nLOF_2020.pdf|AZ_nLOF_2020.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | |[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | ||
| | |AZ 726 MIF developer | ||
| | |DI water | ||
| | |Remover 1165 | ||
|[[media:Process_Flow_AZ_nLOF_2020.docx|Process_Flow_AZ_nLOF_2020.docx]] | |[[media:Process_Flow_AZ_nLOF_2020.docx|Process_Flow_AZ_nLOF_2020.docx]] | ||
Revision as of 11:53, 13 September 2013
UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.
Resist Overview
| Resist | Polarity | Manufacturer | Comments | Technical reports | Spin Coating | Developer | Rinse | Remover | Process flows (in docx-format) |
| AZ5214E | Positive | AZ Electronic Materials | Can be used for both positive and reverse processes with resist thickness between 1 to 4um. | AZ5214E.pdf | SSE, KS Spinner, III-V Spinner | 351B developer | DI water | Acetone |
|
| AZ4562 | Positive | AZ Electronic Materials | For process with resist thickness between 6 and 25um. | AZ4500.pdf | SSE, KS Spinner | 351B developer | DI water | Acetone | |
| AZ MiR 701 | Positive | AZ Electronic Materials | High selectivity for dry etch. | AZ_MiR_701.pdf | Spin Track 1 + 2 | AZ 726 MIF developer | DI water | Remover 1165 | Process_Flow_AZ_MiR701.docx |
| AZ nLOF 2020 | Negative | AZ Electronic Materials | AZ_nLOF_2020.pdf | Spin Track 1 + 2 | AZ 726 MIF developer | DI water | Remover 1165 | Process_Flow_AZ_nLOF_2020.docx
| |
| SU8 | Negative | KS Spinner |
|