Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]=== | ===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]=== | ||
Revision as of 14:13, 21 August 2013
UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.
Resist Overview
| Resist | Polarity | Manufacturer | Comments | Technical reports | Spin Coating | Development | Rinse | Remover | Process flows (in docx-format) |
| AZ5214E | Positive | AZ5214E.pdf | SSE, KS Spinner, III-V Spinner |
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| AZ4562 | Positive | AZ4500.pdf | SSE, KS Spinner | ||||||
| AZ MiR 701 | Positive | AZ_MiR_701.pdf | Spin Track 1 + 2 | Process_Flow_AZ_MiR701.docx | |||||
| AZ nLOF 2020 | Negative | AZ_nLOF_2020.pdf | Spin Track 1 + 2 | Process_Flow_AZ_nLOF_2020.docx
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| SU8 | Positive | KS Spinner |
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