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{{cc-nanolab}}
[[Image:DUV_wafers.jpg|250x250px|right|frame|]]


'''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
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[[Category: Equipment |Lithography]]


=Lithography=
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
__TOC__
__TOC__


There are four different types of lithography available at DTU Nanolab:
Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]: UV lithography is used for making features as small as about 1 micrometer
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]  
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]: DUV lithography is used for features as small as 200 nm
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]: The smallest features can be made in our e-beam writers - about 10 nm
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]: for stamping without irradiation
 
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=Comparing lithography methods at DTU Nanolab=
=Comparing lithography methods at DTU Nanolab=


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{| class="wikitable" width="100%"
|-
|-
 
!  !! [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] !! [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]] !! [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] !! [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
|-
|-
|-style="background:silver; color:black"
! scope=row style="text-align: left;" | Generel description
!width="10%"|
| Pattern transfer via ultraviolet (UV) light || Pattern transfer via deep ultraviolet (DUV) light || Patterning by electron beam || Pattern transfer via hot embossing (HE)
!width="16%"| [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
|-
 
 
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Pattern size range
!Generel description
| ~1 µm and up<br>(resist type, thickness, and pattern dependent) || ~200 nm and up<br>(pattern type, shape and pitch dependent) || ~10-1000 nm<br>(and larger at high currents) || ~20 nm and up
|Pattern transfer via UltraViolet (UV) light
|Pattern transfer via Deep UltraViolet (DUV) light
|Patterning by electron beam
|Pattern transfer via hot embossing (HE)
|-
|-
 
! scope=row style="text-align: left;" | Resist type
 
|
UV sensitive:
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
DUV sensitive:
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
|
E-beam sensitive:
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
Imprint polymers:
*Topas
*PMMA
*mr-I 7030R
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Resist thickness range
!Pattern size range
| ~0.5 µm to 200 µm || ~50 nm to 2 µm || ~30 nm to 1 µm || ~100 nm to 2 µm
|
*Resist type, thickness, and pattern dependent
*~0.6 µm and up
|
*pattern type, shape and pitch dependent
*~200 nm and up
|
*~12 nm - 1 µm (and larger at high currents)
|
*~20 nm and up
|-
|-
! scope=row style="text-align: left;" | Typical exposure time
| Mask aligner: 10-180 s per wafer<br>Maskless aligner: 5-60 minutes per wafer
|
Process dependent:
*Pattern
*Pattern area
*Dose


|-
Throughput is up to 60 wafers/hour
|-style="background:WhiteSmoke; color:black"
|  
!Resist type
Process dependent:
|
*Dose [µC/cm<sup>2</sup>]: <math>Q</math>
*UV sensitive:
*Beam current [A]: <math>I</math>
**AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*Pattern area [cm<sup>2</sup>]: <math>a</math>
**AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
*DUV sensitive
**JSR KRF M230Y, JSR KRF M35G (positive)
**UVN2300-0.8 (negative)
|
*E-beam sensitive
**AR-P6200 CSAR, ZEP502A , PMMA (positive)
**HSQ, mr-EBL, AR-N 7520 (negative)
|
*Imprint polymers:
**Topas
**PMMA
**mr-I 7030R
|-


Process time [s]: <math>t = \frac{Q \sdot a}{I}</math>
| Process dependent, including heating/cooling rates
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Substrate size
!Resist thickness range
|  
|
*chips down to 3 mm x 3 mm
~0.5µm to 200µm
|
~50nm to 2µm
|
~30nm to 1 µm
|
~ 100nm to 2µm
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
10s-3min pr. wafer using mask aligners.
 
10min-5hours pr. wafer using maskless aligners.
|
Process depended, depends on pattern, pattern area and dose.
 
Throughput is up to 60 wafers/hour.
|
Depends on dose, Q [µC/cm<sup>2</sup>], beam current, I [A], and pattern area, A [cm<sup>2</sup>]:
 
t = Q*A/I
|
Process depended, depends also on heating and cooling temperature rates
|-
 
 
|-
|-style="background:LightGrey; color:black"
!Substrate size
|
*small samples, down to 3x3 mm<sup>2</sup>
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers  
|
|  
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers
|
|  
We have cassettes that fit to
We have cassettes fitting:
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*6 wafers of 50 mm in size
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*1 wafer of 200 mm in size
*1 wafer of 200 mm in size
Only one cassette can be loaded at a time
Only one cassette can be loaded at a time
|
|  
*small samples
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
|-
|-
 
! scope=row style="text-align: left;" | Allowed materials  
|-style="background:WhiteSmoke; color:black"
| Any standard cleanroom material
!'''Allowed materials'''
| Any standard cleanroom material
|
|  
*Any standard cleanroom material  
Any standard cleanroom material, except:
|
*Materials that will degas
*Any standard cleanroom material  
*Graphene requires special treatment  
|
| Any standard cleanroom material  
*Any standard cleanroom material, except materials that will degas and special treatment for graphene 
|
*Any standard cleanroom material  
|-
|-
|}
|}
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=Equipment Pages=
=Equipment and Process Pages=
{| style="border-collapse: separate; border-spacing: 1; border:none;padding:0"; cellpadding="10"; cellspacing="5"; width="100%";
|-
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Pre-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific_Process_Knowledge/Lithography/UVLithography|Getting started with UV lithography]]'''


'''[[Specific Process Knowledge/Lithography/Resist|Resist]]'''
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#DUV_Resist|DUV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]


 
'''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]'''
{| style="color: black;" width="90%"
| colspan="3" |
|-
| style="width: 20%"|
'''<big>Resist</big>'''
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV Resist Overview]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|DUV Resists]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists|E-beam resist]]
 
'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop Shape Analyzer]]


'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Coating & baking</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
'''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]'''
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
 
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]]
'''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spray_Coater|Spray Coater]]


'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
'''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


| style="width: 20%"|
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]</big>'''
'''<big><div class="center">Exposure</div></big>'''
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
<div class="center"><hr width="75%"></div>
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
<br>
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]
'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]'''
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
<!--*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]-->
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]]


'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
'''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]


'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
'''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ|E-Beam Writer 9500 (JEOL JBX-9500FSZ)]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/RaithElphy|Raith Elphy on SEM - LEO]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]


'''<big>[[Specific_Process_Knowledge/Imprinting|NanoImprint Lithography]]</big>'''
'''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]


| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Development</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Development|Manual development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]


| style="width: 20%"|
'''[[Specific Process Knowledge/Lithography/Development|SU-8 development]]'''
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wetbench)]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
*[[Specific Process Knowledge/Lithography/Development#SU8-Developer|Developer: SU8]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper|Developer: TMAH Stepper]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]]


'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
'''[[Specific Process Knowledge/Lithography/Development|Semi-automatic puddle development]]'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]]
*[[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
 
'''[[Specific Process Knowledge/Lithography/Development|Automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
 
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Post-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Descum|Descum]]'''
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_5|Plasma Asher 5]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]


'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
'''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]'''
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]


'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
'''[[Specific Process Knowledge/Lithography/Strip|Strip]]'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_5|Plasma Asher 5]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
|}
|}
<br clear="all" />
<br clear="all" />


=Lithography Tool Package Training=
=Lithography Tool Package Training=


DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.


DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.  
You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].  


The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here]




'''For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].'''
'''TPT lithography course contents'''
* Online lecture videos
* Online quiz for each lecture video




{|border="1" cellspacing="0" cellpadding="3" align="left" style="text-align:left;" style="width: 70%;"
'''Learning objectives'''
|-
* Coating
 
* Exposure
|-
* Development
|-style="background:White; color:black; text-align:center"
* Resist, substrates and pre-treatment
!colspan="2"|Lithography Tool Package Training
* Post-lithography steps
|-
 
|-
!Schedule
|
<!--'''<span style="color: red;">OBS: The December Litho TPT has been cancelled due to sickness. Contact the Lithography Group for rescheduling if this poses a problem.</span>''' <span style="text-decoration: line-through;">'''NEXT LECTURE: Tuesday 29th of November 9:15 - 13:00 (B347, Seminar room)'''</span>-->
'''Theoretical part'''
* Lecture videos that can be viewed at one's leisure.
* A 1 hour "questions and exercises" session 2 times a month (typically Fridays 09:30-10:30).
<!--* NEXT "questions and exercises" sessions: '''24th of March, 31st of March, 21st of April, 28th of April, 19th of May'''-->
'''Practical part'''
* A 3-4 hour training session 2 times a month, max. 4 persons per session (typically Wednesdays 09:00 - 12:30 or 10:00 - 13:30).
<!--* NEXT training sessions: '''29th of March, 5th of April, 26th of April, 3rd of May, 24th of May'''-->
* This part is not mandatory, and may be replaced by individual trainings if relevant.
|-
 
|-
!Location
|
'''Theoretical part'''
* The location of the "questions and exercises" session is room 121A in building 345C.
'''Practical part'''
* The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
|-
 
|-
!Qualified Prerequisites
|
* Cleanroom safety course at DTU Nanolab
* Admission to the cleanroom must be obtained before the training session
* Theoretical part must be completed before the training session
|-
 
|-
!Preparations
|
'''Before the "questions and exercises" session'''
* Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus)
* Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos.
'''Before training session'''
* Complete the theoretical part (Q&E)
* Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
* Study the equipment manuals. The manuals are available in LabManager.
* Study the TPT process flows (first print, and alignment).
<!--'''Links to literature, lecture videos, training videos, equipment manuals, and process flows can be found in the "Knowledge and Information" section below.'''-->
|-
 
|-
!Course Responsible
|
The Lithography Group at DTU Nanolab [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk].
|-


|-
!Learning Objectives
|
* Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
* Authorization to use spin coater, mask aligner, and developer at DTU Nanolab
* Calculate relevant process parameters
* Analyze and apply your results of lithographic processing
|-


|}
'''Course responsible'''
* Jens Hindborg Hemmingsen
* Thomas Aarøe Anhøj


If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk]


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| colspan="3" |  
|-
|-
| style="width: 20%"|
| style="width: 20%"; valign="top"|
'''<big>Literature</big>'''
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[http://www.microchemicals.com/support/troubleshooter.html Lithography Troubleshooter from MicroChemicals]
*[https://archive.org/details/manualzilla-id-5701639/page/n39/mode/2up Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://www.microchemicals.com/downloads/application_notes.html Application Notes from MicroChemicals]
*[http://www.cnf.cornell.edu/cnf_spietoc.html Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/dokumente/application_notes/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]




'''<big>Lecture videos</big>'''
'''<big>Lecture videos</big>'''
*Lithography TPT lecture videos (7 videos, 2:41 hours in total) on [http://podcast.llab.dtu.dk/index.php?id=302 DTU Podcasts] or [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*Lithography TPT lecture videos:
**Current version (6 videos, 1:28 hours:minutes in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCp7x9OujmVlZWLAnK4CDFR YouTube]
**Old version (7 videos, 2:41 hours in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)


 
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'''<big>Lithography TPT lecture slides</big>'''
<!-- Removed by TARAN 2024-09-27
*[[:Media:Litho_Tool_Package_-_Introduction.pdf|TPT slides: Introduction]]
'''<big>Lithography TPT lecture slides</big>'''<br>
*[[:Media:Litho_Tool_Package_-_Spin_coating.pdf‎|TPT slides: Spin Coating]]
''' NB: Access to slides require login'''
*[[:Media:Litho_Tool_Package_-_Exposure.pdf|TPT slides: UV Exposure]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[[:Media:Litho_Tool_Package_-_Development.pdf‎|TPT slides: Development]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[[:Media:Litho_Tool_Package_-_Post_processing.pdf‎|TPT slides: Post-processing]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[[:Media:Litho_Tool_Package_-_Process_effects_and_examples.pdf|TPT slides: Process Effects and Examples]]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
 
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
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*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-->


'''<big>Training videos</big>'''
'''<big>Training videos</big>'''
Line 357: Line 279:
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
Playlists on YouTube:
'''Playlists on YouTube:'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography TPT training videos]
*[https://www.youtube.com/playlist?list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner (MLA) training videos]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner training videos]
*[https://www.youtube.com/playlist?list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography equipment training videos (old)]
 
 


'''<big>Manuals</big>'''
*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
*Manual Spin Coater: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 Spin Coater: Labspin 02] or [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 Spin Coater: Labspin 03]
*UV Mask Aligner: [http://labmanager.dtu.dk/d4Show.php?id=3822&mach=339 Aligner: MA6 - 2] or [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 KS Aligner]
*Automatic Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=329 Developer: TMAH UV-lithography]
*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]


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'''<big>Manuals</big>'''<br>
''NB: Access to manuals require DTU login''
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
*Manual Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=5073&mach=362 Spin Coater: Labspin 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=5074&mach=387 Spin Coater: Labspin 03]
*Maskless Aligners: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4975&mach=422 MLA 01] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6270&mach=440 MLA 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6618&mach=464 MLA 02]
*UV Mask Aligner: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3822&mach=339 MA6-2]
*Automatic Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3561&mach=329 Developer: TMAH UV-lithography]
*Manual Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3274&mach=324 Developer: TMAH Manual]
*Manual E-beam Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=20599&mach=527 Developer: E-beam Manual]


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'''<big>Process Flows</big>'''
'''<big>Process Flows</big>'''
*[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/FirstEBL#Resist_coating|E-beam resist process flows]]
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resist process flows]]
 
 
'''<big>Resists</big>'''
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV Resist Overview]] (links to manufacturers, technical data, process flows, etc)
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|DUV Resists]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists|E-beam Resist Overview]]
 
 
'''<big>UV Exposure</big>'''
*[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|Information on UV Exposure Dose]]
 
 
'''<big>Electron Beam Exposure</big>'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ#Getting_started|Training on JEOL JBX-9500FSZ]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resists and process flows]]
*[[:File:Lecture E-beam Lithography -LGPE.pdf|Lecture on E-beam Lithography]]
 
 
'''<big>Deep-UV Exposure</big>'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Stepper Lithography]]
 
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Latest revision as of 12:46, 13 January 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Lithography

Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range ~1 µm and up
(resist type, thickness, and pattern dependent)		 ~200 nm and up
(pattern type, shape and pitch dependent)		 ~10-1000 nm
(and larger at high currents)		 ~20 nm and up
Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive:

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive:

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range ~0.5 µm to 200 µm ~50 nm to 2 µm ~30 nm to 1 µm ~100 nm to 2 µm
Typical exposure time Mask aligner: 10-180 s per wafer
Maskless aligner: 5-60 minutes per wafer

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose [µC/cm2]: Q
  • Beam current [A]: I
  • Pattern area [cm2]: a

Process time [s]: t=Q⋅aI

Process dependent, including heating/cooling rates
Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials Any standard cleanroom material Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment
 Any standard cleanroom material


Equipment and Process Pages

Pre-lithography


Getting started with UV lithography

Resist

Substrate Pre-treatment

Coating & baking


Automatic spin coating

Manual spin coating

Spray coating

Soft & hard baking

Exposure


UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography

Development


Manual development

SU-8 development

Semi-automatic puddle development

Automatic puddle development

Post-lithography


Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.

You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via training@nanolab.dtu.dk.

The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course here


TPT lithography course contents

  • Online lecture videos
  • Online quiz for each lecture video


Learning objectives

  • Coating
  • Exposure
  • Development
  • Resist, substrates and pre-treatment
  • Post-lithography steps


Course responsible

  • Jens Hindborg Hemmingsen
  • Thomas Aarøe Anhøj

If you have questions you can contact us via lithography@nanolab.dtu.dk


Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos:
    • Current version (6 videos, 1:28 hours:minutes in total) on YouTube
    • Old version (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Training videos

Playlists on YouTube:


Manuals
NB: Access to manuals require DTU login


Process Flows


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