Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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It is thus essential to find the right balance between the area that needs to be defined and a beam current that will provide sufficient pattern fidelity and quality. During pattern writing the tool will also use time on cyclic calibration and stage movement as defined by the job path and pattern layout. The exposure time can be estimated based | It is thus essential to find the right balance between the area that needs to be defined and a beam current that will provide sufficient pattern fidelity and quality. During pattern writing the tool will also use time on cyclic calibration and stage movement as defined by the job path and pattern layout. [https://labmanager.dtu.dk/function.php?module=Machine&view=jeol_writing_time The exposure time can be estimated based here.] | ||
= Exposure information = | = Exposure information = | ||
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Pattern preparation is somewhat different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct pattern preparation section below. | Pattern preparation is somewhat different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct pattern preparation section below. | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLPatternPreparation|Pattern preparation for exposure on JEOL 9500 | *[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLPatternPreparation|Pattern preparation for exposure on JEOL 9500]] | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/RaithPatternPreparation|Pattern preparation for exposure on Raith eLine Plus | *[[Specific Process Knowledge/Lithography/EBeamLithography/RaithPatternPreparation|Pattern preparation for exposure on Raith eLine Plus]] | ||
== Job preparation == | == Job preparation == | ||
Job preparation is also different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct job preparation section below. | Job preparation is also different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct job preparation section below. | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation|Job preparation for exposure on JEOL 9500 | *[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation|Job preparation for exposure on JEOL 9500]] | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/RaithJobPreparation|Job preparation for exposure on Raith eLine Plus | *[[Specific Process Knowledge/Lithography/EBeamLithography/RaithJobPreparation|Job preparation for exposure on Raith eLine Plus]] | ||
== Job execution == | == Job execution == | ||
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== Development == | == Development == | ||
AR 600- | AR 600-50 and ZED N-50 developers are available in a semi automatic puddle developer [[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam_02|Developer: E-beam 02]] in E-4, mainly intended for development of AR-P 6200 and ZEP 520A. It has automatic recipes for puddle development cycles for 10, 30 and 60 seconds of either of the two developers, each finishing off with an IPA rinse and drying cycle. The system can handle chips, 2", 4", 6" and 8" wafers. | ||