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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''


=Lithography=
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
__TOC__


'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:
<!-- Replace "http://labadviser.danchip.dtu.dk/..." with the link to the Labadviser page-->
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]: UV lithography is used for making features as small as about 1 micrometer
 
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]: DUV lithography is used for features as small as 200 nm
== Available lithography methods at Danchip ==
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]: The smallest features can be made in our e-beam writers - about 10 nm
 
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]: for stamping without irradiation
There are a broad varity of lithography methods at Danchip. The methods are compared here to make it easier for you to compare and choose the one that suits your needs.  
<br clear="all" />
 
*[[/Deposition of silicon nitride using LPCVD|Process description using method 1]]
<!-- Link to the process info page in LabAdviser -->
 
*[[/Deposition of silicon nitride using LPCVD|Process description using method 2]]
<!-- Link to the process info page in LabAvdiser -->
 
==Comparing lithography methods at Danchip==
 
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
|-
 
|-
|-style="background:silver; color:black"
!
![[Specific Process Knowledge/Lithography/UV Lithography|UV Lithography]]
![[/DUV Lithography|DUV Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon polymerization Lithography]]
 
|-


|-
=Comparing lithography methods at DTU Nanolab=
|-style="background:WhiteSmoke; color:black"
!Generel description
|Generel description - method 1
|Generel description - method 2
|3
|4
|5
|-


{| class="wikitable" width="100%"
|-
|-
|-style="background:LightGrey; color:black"
!  !! [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] !! [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]] !! [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] !! [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
!Pattern size range
|
*~1µm and up
|
*~200nm and up
|
*~10nm and up
|
*~20nm and up
|
*3D: 0.3 µm spot; 1.3 µm high
|-
|-
 
! scope=row style="text-align: left;" | Generel description
| Pattern transfer via ultraviolet (UV) light || Pattern transfer via deep ultraviolet (DUV) light || Patterning by electron beam || Pattern transfer via hot embossing (HE)
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Pattern size range
!Resist type
| ~1 µm and up<br>(resist type, thickness, and pattern dependent) || ~200 nm and up<br>(pattern type, shape and pitch dependent) || ~10-1000 nm<br>(and larger at high currents) || ~20 nm and up
|
*UV sensitive:
**AZ
**SU-8
|
*DUV sensitive
**KSF M230Y
**KSF M35G
|
*E-beam sensitive
**ZEP502A (positive)
**HSQ (negative)
**SU-8
|
*Imprint polymers:
**??
|
*UV cross-linking:
**IP photoresists
**SU-8
|-
|-
! scope=row style="text-align: left;" | Resist type
|
UV sensitive:
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
DUV sensitive:
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
|
E-beam sensitive:
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
Imprint polymers:
*Topas
*PMMA
*mr-I 7030R
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Resist thickness range  
!Resist thickness range
| ~0.5 µm to 200 µm || ~50 nm to 2 µm || ~30 nm to 1 µm || ~100 nm to 2 µm
|
*~0.5µm to 20µm?
|
*~50nm to 2µm?
|
*~30nm to 0.5 µm
|
*~20nm to 10µm?
|
*?nm - ?µm
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
2s-30s pr. wafer
|
?-? pr. ?
|
Depends on dose (in units of muC/cm2), estimate exposure time on sheet 2 of e-beam logbook
|
? pr. wafer
|
? pr. µm2
|-
|-
! scope=row style="text-align: left;" | Typical exposure time
| Mask aligner: 10-180 s per wafer<br>Maskless aligner: 5-60 minutes per wafer
|
Process dependent:
*Pattern
*Pattern area
*Dose


Throughput is up to 60 wafers/hour
|
Process dependent:
*Dose [µC/cm<sup>2</sup>]: <math>Q</math>
*Beam current [A]: <math>I</math>
*Pattern area [cm<sup>2</sup>]: <math>a</math>


Process time [s]: <math>t = \frac{Q \sdot a}{I}</math>
| Process dependent, including heating/cooling rates
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Substrate size
!Substrate size
|  
|
*chips down to 3 mm x 3 mm
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
|
*200 mm wafers
|  
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers
|
|  
We have cassettes that fit to
We have cassettes fitting:
*4 small samples (20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*6 wafers of 50 mm in size
*2 wafers of 100 mm in size
*3 wafers of 100 mm in size
*1 wafer of 150 mm in size  
*1 wafer of 150 mm in size  
Only one cassette can be loaded at time
*1 wafer of 200 mm in size
|
Only one cassette can be loaded at a time
|  
*small samples
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers
|
*Cover slides
*50 mm wafers
*100 mm wafers
*IBIDI
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Allowed materials  
!'''Allowed materials'''
| Any standard cleanroom material
|
| Any standard cleanroom material
*Allowed material 1
|  
*Allowed material 2
Any standard cleanroom material, except:
|
*Materials that will degas
*Allowed material 1
*Graphene requires special treatment
*Allowed material 2
| Any standard cleanroom material  
*Allowed material 3
|
*Si, SiO2, III-V materials
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|-
|-
|}
|}
<br clear="all" />
=Equipment and Process Pages=
{{:Specific Process Knowledge/Lithography/UVlithographyProcessPages}}
=Lithography Tool Package Training=
DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.
You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here]
'''TPT lithography course contents'''
* Online lecture videos
* Online quiz for each lecture video
'''Learning objectives'''
* Coating
* Exposure
* Development
* Resist, substrates and pre-treatment
* Post-lithography steps
'''Course responsible'''
* Jens Hindborg Hemmingsen
* Thomas Aarøe Anhøj
If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk]


<br clear="all" />
<br clear="all" />
=Knowledge and Information about Lithography=
{| style="color: black;" width="90%"
| colspan="3" |
|-
| style="width: 20%"; valign="top"|
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[https://archive.org/details/manualzilla-id-5701639/page/n39/mode/2up Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/dokumente/application_notes/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]




==Equipment List==
'''<big>Lecture videos</big>'''
*Lithography TPT lecture videos:
**Current version (6 videos, 1:28 hours:minutes in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCp7x9OujmVlZWLAnK4CDFR YouTube]
**Old version (7 videos, 2:41 hours in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)


===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]===
| style="width: 20%"; valign="top"|
*[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]
<!-- Removed by TARAN 2024-09-27
*[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]
'''<big>Lithography TPT lecture slides</big>'''<br>
*[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]
''' NB: Access to slides require login'''
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-->


===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]===
'''<big>Training videos</big>'''
===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]===
*[https://www.youtube.com/watch?v=3JhM3rmLVpA Training Video: Automatic Spin Coater]
===[[Specific Process Knowledge/Lithography/Baking|Baking]]===
*[https://www.youtube.com/watch?v=_neUkDsQhsM: Training Video: Manual Spin Coater Labspin]
===[[Specific Process Knowledge/Lithography/Developing|Developing]]===
*[https://www.youtube.com/watch?v=o8IBtfQHNzU Training Video: UV Mask Aligner Part I (Operation)]
===[[Specific Process Knowledge/Lithography/StripLiftOff|Strip, Lift-off]]===
*[https://www.youtube.com/watch?v=rvUuXYgw-xU Training Video: UV Mask Aligner Part II (Alignment)]
===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]===
*[https://www.youtube.com/watch?v=GyTQNmbev2c Training Video: Maskless aligner Training Video]
===[[Specific Process Knowledge/Lithography/Characterization|Characterization]]===
*[https://www.youtube.com/watch?v=Vpa9QoCHA4I Training Video: Maskless aligner Conversion]
===[[Specific Process Knowledge/Lithography/LaserWriter|LaserWriter]]===
*[https://www.youtube.com/watch?v=wIF-oqVR1Dc Training Video: Maskless aligner Series and Navigation]
===[[Specific Process Knowledge/Lithography/DUVStepper|DUV Stepper]]===
*[https://youtu.be/yclriey6xpM Training Video: Maskless aligner Alignment]
===[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]]===
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
===[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]===
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
===[[Specific Process Knowledge/Lithography/3D|3D]]===
'''Playlists on YouTube:'''
*[https://www.youtube.com/playlist?list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner (MLA) training videos]
*[https://www.youtube.com/playlist?list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography equipment training videos (old)]
 
 
| style="width: 20%"; valign="top"|
'''<big>Manuals</big>'''<br>
''NB: Access to manuals require DTU login''
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
*Manual Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=5073&mach=362 Spin Coater: Labspin 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=5074&mach=387 Spin Coater: Labspin 03]
*Maskless Aligners: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4975&mach=422 MLA 01] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6270&mach=440 MLA 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6618&mach=464 MLA 02]
*UV Mask Aligner: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3822&mach=339 MA6-2]
*Automatic Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3561&mach=329 Developer: TMAH UV-lithography]
*Manual Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3274&mach=324 Developer: TMAH Manual]
*Manual E-beam Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=20599&mach=527 Developer: E-beam Manual]
 
 
'''<big>Process Flows</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/FirstEBL#Resist_coating|E-beam resist process flows]]
|}
<br clear="all" />

Latest revision as of 08:44, 15 April 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Lithography

Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range ~1 µm and up
(resist type, thickness, and pattern dependent)		 ~200 nm and up
(pattern type, shape and pitch dependent)		 ~10-1000 nm
(and larger at high currents)		 ~20 nm and up
Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive:

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive:

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range ~0.5 µm to 200 µm ~50 nm to 2 µm ~30 nm to 1 µm ~100 nm to 2 µm
Typical exposure time Mask aligner: 10-180 s per wafer
Maskless aligner: 5-60 minutes per wafer

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose [µC/cm2]: Q
  • Beam current [A]: I
  • Pattern area [cm2]: a

Process time [s]: t=Q⋅aI

Process dependent, including heating/cooling rates
Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials Any standard cleanroom material Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment
 Any standard cleanroom material


Equipment and Process Pages

Pre-lithography


Getting started with UV lithography

Resist

Substrate Pre-treatment

Coating


Automatic spin coating

Manual spin coating

Spray coating

Soft & hard baking

Exposure


UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography

Development


Manual development

SU-8 development

Semi-automatic puddle development

Automatic puddle development

Post-lithography


Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.

You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via training@nanolab.dtu.dk.

The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course here


TPT lithography course contents

  • Online lecture videos
  • Online quiz for each lecture video


Learning objectives

  • Coating
  • Exposure
  • Development
  • Resist, substrates and pre-treatment
  • Post-lithography steps


Course responsible

  • Jens Hindborg Hemmingsen
  • Thomas Aarøe Anhøj

If you have questions you can contact us via lithography@nanolab.dtu.dk


Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos:
    • Current version (6 videos, 1:28 hours:minutes in total) on YouTube
    • Old version (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Training videos

Playlists on YouTube:


Manuals
NB: Access to manuals require DTU login


Process Flows


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography&oldid=51591"