The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Development Comparison Table

	Manual beaker development	Developer: SU8 (Wet bench)	Developer: E-beam 02	Developer: TMAH Manual 02	Developer: TMAH UV-lithography	Developer: TMAH Stepper
Purpose	Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools Requires individual risk assessment for TMAH development!	Development of: SU-8	Development of: ZEP 520A AR-P 6200.xx (CSAR)	Development of: AZ nLOF AZ MiR 701 AZ 5214E AZ 4562 DUV resists	Development of: AZ nLOF AZ MiR 701 AZ 5214E AZ 4562 DUV resists Post-exposure baking	Development of: DUV resists Post-exposure baking
Developer	Process dependent	mr-Dev 600 (PGMEA)	ZED N-50 AR 600-50	AZ 726 MIF (2.38% TMAH in water)	AZ 726 MIF (2.38% TMAH in water)	AZ 726 MIF (2.38% TMAH in water)
Method	Submersion	Submersion	Puddle	Puddle	Puddle	Puddle
Handling	Manual handling in beakers Chip bucket Single wafer carrier Carrier for up to 5 wafers	Chip bucket Single wafer carrier Carrier for up to 6 wafers	Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates Chip chuck for chips & 50 mm substrates	Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates Chip chuck for chips & 50 mm substrates	Vacuum chuck	Vacuum chuck
Process temperature	Room temperature	Room temperature	Room temperature	Room temperature	Room temperature	Room temperature
Process agitation	No agitation allowed	Magnetic stirrer	Rotation	Rotation	Rotation	Rotation
Process rinse	Process dependent	IPA	IPA	DI water	DI water	DI water
Substrate size	Chips 50 mm wafers 100 mm wafers 150 mm wafers	Chips 50 mm wafers 100 mm wafers 150 mm wafers 200 mm wafers	Chips (5mm to 2") 50 mm wafers 100 mm wafers 150 mm wafers 200 mm wafers	Chips (5mm to 50 mm) 100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers 200 mm wafers (may require tool change)	100 mm wafers 150 mm wafers 200 mm wafers (may require tool change)
Allowed materials	All cleanroom approved materials	Silicon and glass substrates Film or pattern of all but Type IV	All cleanroom approved materials	All cleanroom approved materials Film or pattern of all types	Silicon and glass substrates Films, or patterned films, of any material except type IV (Pb, Te)	Silicon, III-V, and glass substrates Films, or patterned films, of any material except type IV (Pb, Te)
Batch size	1 - 5	1 - 6	1	1	1 - 25	1 - 25

Decommisioned tools

Developer 1 & 2 were decommissioned 2017-01. Information about decommissioned tool can be found here.

Developer 6 inch was decommissioned 2019-12. Information about decommissioned tool can be found here.