Specific Process Knowledge/Lithography/Coaters

Coaters: Comparison Table

Equipment		SSE Spinner	Spin Coater: RCD8	Spin Track 1 + 2	Spin Coater: Manual All Resists	Spin Coater: Manual Standard Resists	Spin Coater: Manual All Purpose	Spray Coater
Purpose		Coating and baking of AZ5214E resist AZ4562 resist E-beam resist (for batches > 25 wafers)	Coating of SU-8 resist AZ 5214E resist AZ 4562 resist AZ MiR resist AZ nLOF resist	In-line substrate HMDS priming Coating and baking of AZ MiR 701 (29cps) resist AZ nLOF 2020 resist Post-exposure baking at 110°C	Coating of all resists	Coating of CSAR ZEP PMMA/MMA HSQ (FOx) AZ 5214E resist AZ 4562 resist AZ MiR resist AZ nLOF resist	Coating of CSAR ZEP PMMA/MMA HSQ (FOx) AZ 5214E resist AZ 4562 resist AZ MiR resist AZ nLOF resist ESPACER	Spraying imprint resist Spraying photoresist Spraying of other solutions
Performance	Substrate handling	Cassette-to-cassette Edge handling chuck	Single substrate Non-vacuum chuck for fragile substrates	Cassette-to-cassette	Single substrate Edge handling chuck	Single substrate		Can handle almost any sample size and shape
	Permanent media	AZ5214E resist AZ4562 resist Acetone for chuck cleaning Acetone for drip pan	No permanent media	AZ MiR 701 (29cps) resist AZ nLOF 2020 resist PGMEA for backside rinse and edge-bead removal PGMEA for spinner bowl cleaning and vapor tip bath	Only manual dispense			No permanent media
	Manual dispense option	2 automatic syringes	yes pneumatic dispense for SU-8 resist	no				Two syringe pumps
Process parameter range	Spindle speed	100 - 5000 rpm	10 - 5000 rpm (3000 rpm with non-vacuum chuck)	10 - 9990 rpm	100 - 5000 rpm	100 - 5000 rpm	100 - 7000 rpm
	Gyrset	optional	optional (max. speed 3000 rpm)	no	no	no	no
Substrates	Substrate size	50 mm wafers 100 mm wafers 150 mm wafers	100 mm wafer 150 mm wafer	100 mm wafers 150 mm wafers (tool change required)	50 mm wafers 100 mm wafers 150 mm wafers small pieces down to 10x10 mm2	50 mm wafers 100 mm wafers 150 mm wafer small pieces down to 10x10 mm2	50 mm wafers 100 mm wafers 150 mm wafer small pieces down to 3x3 mm2	Any sample(s) that fit inside machine
	Batch size	1-24	1	1-25	1	1	1	1
	Allowed materials	All cleanroom materials except III-V materials	All cleanroom materials except III-V materials	Silicon Glass	III-V materials Si, SiO2, SOI	All cleanroom materials	All cleanroom materials	All chemicals to be spray coated must be approved specifically for spray coating Any non-toxic, non-particulate and non-crosslinking material is likely to be approved

SSE Spinner

The SSE spinner MAXIMUS: positioned in E-5

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Coater comparison table

SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.

The system is equipped with 2 different resists lines:

• AZ 5214E
• AZ 4562

and

• 2 syringe lines, which can be used for spinning of e-beam resist.

The user manual, user APV, and contact information can be found in LabManager

Process information

The typical flow for resist spinning is divided in 3 steps: video, spinning and soft bake. You need to create a separate recipe for each station and then collect the recipes in a flow. For the video station we have 3 standard recipes for 3 different wafer sizes: 2inch, 4inch, 6inch. To create a recipe for the coater station you need to describe spinning sequence using the predefined functions. Then you create recipe for the hotplates. After all recipes are created they can be set together in the different flows. It is why we are not recommending the user just change some parameters in the recipe, this change can effect some other flows.

• General SSE spinner process information
• AZ5214E coating on SSE Spinner

Flow names, process parameters, and test results:

• DCH 100mm 1,5µm AZ5214E

Spin-off: xx s at yyyy rpm.

Substrate	Thickness	Uniformity (+/-)	Test date	Tester initials	Comments
Silicon with native oxide	1,367	3,1%	10/7 2015	chasil	with HMDS. Average of 3 wafers
Silicon with native oxide	1,409	2,4%	12/15 2015	chasil	with HMDS. Average of 3 wafers

Equipment performance and process related parameters

Purpose		Spin coating and soft baking UV sensative resists Spin coating and soft baking E-beam resists
Resist		AZ5214E AZ4562 E-beam resists
Performance	Coating thickness	AZ5214E 1-4,2 µm AZ4562 6,2-25 µm E-beam resists 0,1-1 µm
Process parameters	Spin speed	100 - 5000 rpm
	Spin acceleration	100 - 10000 rpm/s
	Hotplate temperature	90°C for softbaking of AZ5214E resist 100°C for softbaking of AZ4562 resist 110°C for reverse baking of AZ5214E resits 180°C for softbaking of e-beam resits
Substrates	Substrate size	50 mm wafers 100 mm wafers 150 mm wafers
	Allowed materials	All cleanroom materials except III-V materials
	Batch	1 - 24

Spin Track 1 + 2

Spin Track 1 + 2 in C-1

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Coater comparison table

Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.

The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.

The user manual, user APV, and contact information can be found in LabManager

Process information

• General Spin Track 1 + 2 process information
• HMDS priming on Spin Track 1 and 2
• AZ MiR 701 (29cps) coating on Spin Track 1
• AZ nLOF 2020 coating on Spin Track 2
• Post-exposure baking on Spin Track 2

Equipment performance and process related parameters

Spin Track		1	2
Purpose		HMDS priming Spin coating and soft baking Priming, coating, and baking	HMDS priming Spin coating and soft baking Priming, coating, and baking Post-exposure baking
Resist		AZ MiR 701 (29cps) positive tone	AZ nLOF 2020 negative tone
Performance	Coating thickness	1 - 3 µm	1 - 4 µm
	HMDS contact angle	60° - 90°; standard recipe 82° (on SiO2)
Process parameters	Spin speed	10 - 9990 rpm
	Spin acceleration	1000 - 50000 rpm/s
	Hotplate temperature	90°C	110°C
	HMDS priming temperature	50°C
Substrates	Substrate size	100 mm wafers
	Allowed materials	Silicon and glass wafers Film or pattern of all types
	Batch	1 - 25

Spin Coater: Gamma UV

This section is under construction

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Coater comparison table

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The user manual, user APV, and contact information can be found in LabManager

Process information

Standard Processes:

• HMDS
• AZ MiR 701
• AZ nLOF 2020
• AZ 5214E

Equipment performance and process related parameters

Purpose		HMDS priming Spin coating of PGMEA based UV resists Spin coating of E-beam resists 1) Soft baking
Resist		AZ MiR 701 (29cps) AZ nLOF 2020 AZ 5214E 100cc syringe dispense
Performance	HMDS contact angle	60 - 80°
	Coating thickness	AZ MiR 701: 1.5-4 µm AZ nLOF 2020: 1.5-5 µm AZ 5214E: 1.5-5 µm AZ 4562: 5-15 µm
Process parameters	Priming temperature	25 - 120 °C
	Spin speed	10 - 7000 rpm
	Spin acceleration	10 - 10000 rpm/s
	Hotplate temperature	25 - 200 °C
	Cool plate temperature	21 °C
Substrates	Substrate size	50 mm wafers 1) 100 mm wafers 150 mm wafers 200 mm wafers 1)
	Allowed materials	Silicon and glass
	Batch	1-25

¹⁾ Requires tool change.

Spin Coater: RCD8

Spin coater: RCD8 is located in C-1

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Coater comparison table

Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater can also be used for coating of substrates with e.g. textured backsides or membranes.

The user manual, user APV, and contact information can be found in LabManager

Process information

• Spin coating
• Automatic dispense
• Standard recipes
• Template recipes

Equipment performance and process related parameters

Purpose		Spin coating of SU-8 resists Spin coating of PGMEA based AZ resists
Resist		manual dispense automatic dispense from syringe
Performance	Coating thickness	SU-8 resits: 0.1-200+ µm AZ 5214E: 1.5-3 µm AZ 4562: 8-15 µm AZ MiR 701: 1.5-3 µm AZ nLOF 2020: 2-3.5 µm
Process parameters	Spin speed	Vacuum chuck: 10 - 5000 rpm Non-vacuum chuck: Max. 3000 rpm
	Spin acceleration	10 - 3000 rpm/s Max. 1500 rpm/s with Gyrset
Substrates	Substrate size	100 mm wafers 150 mm wafers
	Allowed materials	All cleanroom materials ?
	Batch	1

Manual Spin Coaters

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Spin Coater: Manual All Resists	Spin Coater: Manual Standard Resists	Spin Coater: Manual All Purpose
Loacted in fumehood in A-5	Located in fumehood in E-5	Located in fumehood in C-1
Labspin 6, Süss	Labspin 6, Süss	WS-650, Laurell
LabManager	LabManager	LabManager
Spin curves: AZ5214E‎, AZnLoF 2020, ZEP520A‎, FOX-15