2nd Level - Process Topic
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Overview of sample processing
Clean the sample
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Drying Samples
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Make a layer on the sample or Film Formation
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Thermal Oxide growth
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Physical Vapour Deposition
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Sputter deposition
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Thermal deposition
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E-beam evaporation
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CVD
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LPCVD
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PECVD
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Coating
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Spin coating
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Spray coating
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Electroplating
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Epitaxial growth
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Thermal treatment of the sample
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Make a mask on the sample
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Lithography
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Imprinting
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Transfer pattern into the sample
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Wet etch
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Dry etch
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Lift-off
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Direct structure definition
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Imprinting
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LASER machining
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Lithographic definition
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Polymer Injection molding
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Back end of the sample
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Chip/die mounting
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Wire bonding
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Dicing
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Overview of sample processing 2
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Thermal Oxide growth
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Thin Film deposition
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Sputter deposition
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Thermal deposition
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E-beam evaporation
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CVD
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LPCVD
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PECVD
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Coating
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Spin coating
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Spray coating
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Electroplating
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Epitaxial growth
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Lithography
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Imprinting
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Transfer pattern into the sample
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Wet etch
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Dry etch
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Lift-off
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Direct structure definition
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Imprinting
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LASER machining
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Lithographic definition
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Polymer Injection molding
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Back end of the sample
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Chip/die mounting
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Wire bonding
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Dicing
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Overview of sample processing 3
Create a layer/film on your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process/Oxidation
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Thermal oxidation
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Thermal SiO2
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Thin film deposition
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Sputter deposition
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Si,SiO2,Si3N3,TiO2, metals
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Thermal evaporation
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Al, ?
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E-beam evaporation
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Metals
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LPCVD
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Si3N4, SRN, SiO2, Si (poly and amorph)
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PECVD
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Si3N4, SiO2, PBSG
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Electroplating
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Ni
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Lithography/Coaters
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Spin coating
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resists, polymers
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Spray coating
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resists, polymers
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Epitaxial growth
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MOCVD
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?
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Thermal treatment of your sample
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Make a mask on your sample
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Entry page in LabAdviser
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Techniques
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Lithography
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Photolithography
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Deep UV lithography
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E-beam lithography
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Imprinting
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Transfer mask pattern to your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Etch
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Wet etch
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Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
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Dry etch
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Any material
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Lift-off
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?
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Defining your structur diretly (no mask)
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Imprinting
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LASER machining
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Lithographic definition
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Polymer Injection molding
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Bonding your samples together
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Back end processing of your sample
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Chip/die mounting
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Wire bonding
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Dicing
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