Jump to content

Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

From LabAdviser
Jehem (talk | contribs)
No edit summary
Jehem (talk | contribs)
No edit summary
Line 209: Line 209:
|-  
|-  
|}
|}
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MA6-1}}
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MA6-2}}
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA1}}
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA2}}
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA3}}
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA4}}


=Decommisioned tools=
=Decommisioned tools=

Revision as of 10:09, 25 June 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

UV Exposure Comparison Table

Equipment Aligner: MA6-1 Aligner: MA6-2 Aligner: Maskless 01 Aligner: Maskless 02 Aligner: Maskless 03 Aligner: Maskless 04
Purpose
  • Top Side Alignment
  • Back Side Alignment
  • UV exposure

OBS: this tool is in PolyFabLab

  • Top Side Alignment
  • Back Side Alignment
  • UV exposure
  • (DUV exposure)
  • Bond alignment
  • Top Side Alignment
  • Maskless UV exposure
  • Top Side Alignment
  • Back Side Alignment
  • Maskless UV exposure
  • Top Side Alignment
  • Back Side Alignment
  • Maskless UV exposure
  • Top Side Alignment
  • Maskless UV exposure
  • Direct laser writing

OBS: this tool is in PolyFabLab

Performance Minimum feature size

~1 µm

~1 µm

~1 µm

~1 µm

~1 µm

~1 µm

Alignment accuracy
  • TSA: ±2 µm
  • BSA: ±5 µm
  • TSA: ±1 µm
  • BSA: ±2 µm

±2 µm
(±1 µm possible)

  • TSA: ± 0.5 µm
  • BSA: ± 1 µm
  • TSA: ± 0.5 µm
  • BSA: ± 1 µm

±1 µm

Exposure light
  • 350W Hg lamp
  • i-line filter (365nm bandpass filter)
  • 500W Hg-Xe lamp
  • i-line filter (365nm bandpass filter)

365nm LED

375nm laser diode array

405nm laser diode array

  • 365nm LED
  • 405nm laser diode
Exposure mode
  • Flood exposure
  • Proximity
  • Contact:
    • Soft contact
    • Hard contact
    • Vacuum contact
  • Flood exposure
  • Proximity
  • Contact:
    • Soft contact
    • Hard contact
    • Vacuum contact
  • Projection:
    • Pneumatic auto-focus
  • Projection:
    • Optical auto-focus
    • Pneumatic auto-focus
  • Projection:
    • Pneumatic auto-focus
  • Projection:
    • Optical auto-focus
    • Pneumatic auto-focus
  • Direct laser writing:
    • Optical auto-focus
    • Pneumatic auto-focus
Substrates Batch size
  • 1 100 mm wafer
  • 1 small sample, down to 10x10 mm2
  • 1 50 mm wafer
  • 1 100 mm wafer
  • 1 150 mm wafer
  • 1 small sample, down to 5x5 mm2
  • 1 50 mm wafer
  • 1 100 mm wafer
  • 1 150 mm wafer (exposure area only 125x125 mm2)
  • 1 small sample, down to 3x3 mm2
  • 1 50 mm wafer
  • 1 100 mm wafer
  • 1 150 mm wafer
  • 1 200 mm wafer
  • 1 small sample, down to 5x5 mm2
  • 1 50 mm wafer
  • 1 100 mm wafer
  • 1 150 mm wafer
  • 1 small sample, down to 3x3 mm2
  • 1 50 mm wafer
  • 1 100 mm wafer
  • 1 150 mm wafer
Allowed materials
  • All PolyFabLab materials
  • All cleanroom materials except copper and steel
  • Dedicated chuck for III-V materials
  • All cleanroom materials
  • All cleanroom materials
  • All cleanroom materials
  • All PolyFabLab materials

Decommisioned tools

Inclined UV lamp was decommissioned 2023.

Information about decommissioned tool can be found here.