Specific Process Knowledge/Lithography/Development: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]]</b> | |||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]</b> | ||
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Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools | |||
Requires individual risk assessment! | |||
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!style="background:silver; color:black" align="center" width="60"|Developer | !style="background:silver; color:black" align="center" width="60"|Developer | ||
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Process dependent | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method | ||
|style="background:LightGrey; color:black"|Development | |style="background:LightGrey; color:black"|Development | ||
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Submersion | |||
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Submersion | Submersion | ||
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|style="background:LightGrey; color:black"|Handling | |style="background:LightGrey; color:black"|Handling | ||
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Manual handling in beakers | |||
*Chip bucket | |||
*Single wafer carrier | |||
*Carrier for up to 5 wafers | |||
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*Single wafer carrier | *Single wafer carrier | ||
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|style="background:LightGrey; color:black"|Temperature | |style="background:LightGrey; color:black"|Temperature | ||
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Room temperature | |||
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Room temperature | Room temperature | ||
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|style="background:LightGrey; color:black"|Agitation | |style="background:LightGrey; color:black"|Agitation | ||
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No agitation allowed | |||
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Magnetic stirrer | Magnetic stirrer | ||
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|style="background:LightGrey; color:black"|Rinse | |style="background:LightGrey; color:black"|Rinse | ||
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Process dependent | |||
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IPA | IPA | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
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* Chips | |||
* 50 mm wafers | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
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|style="background:LightGrey; color:black"|Allowed materials | |style="background:LightGrey; color:black"|Allowed materials | ||
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All cleanroom approved materials | |||
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*Silicon and glass substrates | *Silicon and glass substrates | ||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
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|style="background:WhiteSmoke; color:black" | 1 - 5 | ||
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1 - 6 | 1 - 6 | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
1 | 1 | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
1 | 1 | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
1 - 25 | 1 - 25 | ||
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1 - 25 | 1 - 25 | ||
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