Specific Process Knowledge/Lithography/Strip: Difference between revisions
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'''NB: Use dedicated descum asher Plasma Asher 3: Descum for descumming.''' | '''NB: Use dedicated descum asher Plasma Asher 3: Descum for descumming.''' | ||
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==Process gas ratio== | |||
[[File:PA_gas_mix_v1.png|320px|thumb|Ashing rate as function of gas mix ratio.|right]] | |||
The ashing rate is related to the gas mix, usually expressed as percentage of nitrogen of the total amount of gas. Test using a single 100 mm wafer in the center of the process chamber shows that 30-80% nitrogen gives the highest ashing rate. | |||
<b>Test parameters:</b><br> | |||
Total gas flow rate: 500 sccm<br> | |||
Chamber pressure: 1.2 mbar<br> | |||
Power: 1000 W<br> | |||
Processing time: 2 minutes<br> | |||
Temperature (average): 43°C | |||
<br clear="all" /> | |||
==Process chamber pressure== | |||
==Process gas flow rate== | |||
==Process power== | |||
==Plasma Asher 1== | ==Plasma Asher 1== | ||
<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span> | <span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span> | ||