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Specific Process Knowledge/Lithography/Development: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,915 edits
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AZ 726 MIF
AZ 726 MIF<br>
 
(2.38% TMAH in water)
(2.38% TMAH in water)
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|style="background:LightGrey; color:black"|Handling
|style="background:LightGrey; color:black"|Handling
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*Edge handling chuck for 100 mm and 150 mm wafers
*Vacuum chuck for 100 mm and 150 mm wafers
*Chip chuck for chips and 2" wafers
*Chip chuck for chips and 2" wafers
*Non-vacuum chuck for 100 mm and 150 mm wafers
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
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