Specific Process Knowledge/Lithography/Development: Difference between revisions

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-*AR 600 - 546 (developer X AR 600-54/6) used for CSAR 6200 series resists
+*AR 600-50
-*ZED N-50 used for Zep520A resists
+*ZED N-50
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
 |style="background:LightGrey; color:black"|Development
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-Spray/Puddle
+Puddle
 |-
 |style="background:LightGrey; color:black"|Handling
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-*Vacuum chuck for 100 mm or 150 mm wafers
+*Chip chuck for chips
-*Chip chick for chips and 2" wafers
+*Non-vacuum chuck for 2" wafers
+*Non-vacuum chuck for 100 mm and 150 mm wafers
+*Non-vacuum chuck for 200 mm wafers
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
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 |style="background:LightGrey; color:black"|Agitation
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-Rotational agitation at 15 rpm
+second rotational agitation at 30 rpm every 15 seconds
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 |style="background:LightGrey; color:black"|Substrate size
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-* Chips (6-60 mm)
+*Chips
-* 2" wafers
+*2" wafers
-* 100 mm wafers
+*100 mm wafers
-* 150 mm wafers
+*150 mm wafers
+*200 mm wafers
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 | style="background:LightGrey; color:black"|Allowed materials
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 *Film, or pattern, of all materials except Type IV
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-|style="background:LightGrey; color:black"|Batch
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