Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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==Poor metal (TiAu) adhesion/ Metal delaminating after lift-off== | ==Poor metal (TiAu) adhesion/ Metal delaminating after lift-off== | ||
''This experiment was done by Mathias Zambach (zambach@fysik.dtu.dk) in June 2024'' | ''This experiment was done by Mathias Zambach (zambach@fysik.dtu.dk) in June 2024'' | ||
Mathias experienced the delamination of TiAu after the lift-off process. | |||
[[File:Delamination of TiAu.jpg|thumb]] | |||
-2 um nLOF coating | |||
-Exposure | |||
-Development of nLOF | |||
-5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min) was done right before TiAu deposition | |||
- 10 nm Ti deponering with 2 A/s by Temescal | |||
- 200 nm Au deponering with 2A/s by Temescal | |||
- Lift-off (ca 45 min) | |||