Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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!General description | !General description | ||
|Low Presure Chemical Vapor Deposition TEOS gives a good quality SiO2 and is a batch process. | |Low Presure Chemical Vapor Deposition TEOS gives a good quality SiO2 and is a batch process. | ||
|Plasma Enhanced Chemical Vapor Deposition has the advantage that a silicon oxide and be deposited with a | |Plasma Enhanced Chemical Vapor Deposition has the advantage that a silicon oxide and be deposited with a quite high deposition rate at a rather low temperature | ||
|Sputter deposition: can be done on top of a large range of materials | |Sputter deposition: can be done on top of a large range of materials | ||
|Sputter deposition: can be done on top of a large range of materials. | |Sputter deposition: can be done on top of a large range of materials. | ||