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Specific Process Knowledge/Lithography/SU-8: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
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* exposure using radiation above 350 nm is recommended
* exposure using radiation above 350 nm is recommended
* Controlled soft and post-exposure bakes are recommended and must be optimized for the specific application, but baseline parameters which can be used as a starting point will be given
* Controlled soft and post-exposure bakes are recommended and must be optimized for the specific application, but baseline parameters which can be used as a starting point will be given
You can also take a look at a Ph.D thesis on the topic that you can find in Process2Share: http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Photolithography/SU8#Reports]


==Pretreatment==
==Pretreatment==
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