Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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==Aligner: Maskless 02== | ==Aligner: Maskless 02== | ||
MLA150 WMI maskless aligner from Heidelberg Instruments GmbH. | MLA150 WMI maskless aligner from Heidelberg Instruments GmbH. | ||
'''PC logon password''' | '''PC logon password''' | ||
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Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=440 LabManager] | Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=440 LabManager] | ||
[[ | ===Exposure dose and defocus=== | ||
[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_02|Information on UV exposure dose]] | |||
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]] | ===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing|Process information]]=== | ||
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Exposure_technology|Exposure technology]] | |||
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Features|Features]] | *[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]] | ||
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Features|Features]] | |||
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Alignment|Alignment]] | *[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Alignment|Alignment]] | ||
=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||