Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 15: | Line 15: | ||
In general, the dry etch tools at DTU Nanolab are free to use for users with proper training. The users have freedom to etch the approved materials and substrates within the rules specified in manuals, LabAdviser and cross contamination sheets. At the same time, the instruments are set up to meet the broadest range of etch demands in this way ensuring that most dry etch applications can be covered. Indeed, for most of the instruments there is a continuous tug of war between providing flexibility (for instance allowing mask materials that do not form any volatile etch products with the gas chemistry available in the process chamber) while ensuring process chamber cleanliness. | In general, the dry etch tools at DTU Nanolab are free to use for users with proper training. The users have freedom to etch the approved materials and substrates within the rules specified in manuals, LabAdviser and cross contamination sheets. At the same time, the instruments are set up to meet the broadest range of etch demands in this way ensuring that most dry etch applications can be covered. Indeed, for most of the instruments there is a continuous tug of war between providing flexibility (for instance allowing mask materials that do not form any volatile etch products with the gas chemistry available in the process chamber) while ensuring process chamber cleanliness. | ||
Pegasus 2 stands out as it is a dedicated research tool where | Pegasus 2 stands out as it is a dedicated research tool where much fewer processes are allowed. As such, the instrument will not be released for general use for a wide range of applications. | ||
Whereas | Whereas Pegasus 1 and 3 are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 has been subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run [http://labadviser.nanolab.dtu.dk/images/d/d6/CORE1.pdf '''the CORE process''']. This means that comparing to [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus 1]] and | ||
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below). For instance: | [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below). For instance: | ||
# The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber. | # The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber. | ||
| Line 23: | Line 23: | ||
This kind of experiment will not be allowed on other dry etch tools as it is obvious that this is incompatible with running any of the usual Bosch processes. | This kind of experiment will not be allowed on other dry etch tools as it is obvious that this is incompatible with running any of the usual Bosch processes. | ||
Therefore, you should always make sure that whatever process you may want to run on Pegasus 2 is allowed or even possible. The table below should provide this information. If you want to get access to the tool, then talk to the dry etch group. | |||
Therefore, you should always make sure that whatever process you may want to run on Pegasus 2 is allowed or even possible. The table below should provide this information. If you want to get access to the tool, then talk to | |||
== Current setup and rules on Pegasus 2 == | == Current setup and rules on Pegasus 2 == | ||