Specific Process Knowledge/Lithography/Descum: Difference between revisions
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'''Ashing of AZ MiR701 resist''' | '''Ashing of AZ MiR701 resist''' | ||
You can use different strategy planing your descum: you can change power settings or you can vary chamber pressure during descum. | You can use different strategy planing your descum: you can change power settings or you can vary chamber pressure during descum. | ||
''Testing different power settings'' | ''Testing different power settings'' | ||
[[image:AZMIR701_power_settings.png|right|frame|400x400px| Descum results for different power settings]] | |||
Recipe settings: | Recipe settings: | ||
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''Testing different pressure settings'' | ''Testing different pressure settings'' | ||
Recipe settings: | Recipe settings: | ||
Kept power setting constant at Power: 100% and vary oxydgen flow during process. | Kept power setting constant at Power: 100% and vary oxydgen flow during process. | ||
[[image:AZMIR701_pressure_settings.png|left|frame|400x400px| Descum results for different pressure settings]] | |||
Experiment parameters: | Experiment parameters: | ||
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AZMIR701_pressure_settings.png | |||
'''Ashing of AZ5214E resist''' | '''Ashing of AZ5214E resist''' | ||