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Strip Comparison Table
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Plasma Asher 3: Descum
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Plasma Asher 4 (Clean)
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Plasma Asher 5 (Dirty)
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Resist strip
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Lift-off
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| Purpose
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Resist descum
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- Resist stripping
- Resist descum
- Surface treatment
- Other ashing of organic material
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- Resist stripping
- Resist descum
- Surface treatment
- Other ashing of organic material
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Resist stripping
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Metal lift-off
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| Method
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Plasma ashing
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Plasma ashing
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Plasma ashing
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Solvent & ultrasonication
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Solvent & ultrasonication
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| Process gasses
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O2 (50 sccm)
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- O2 (0-500 sccm)
- N2 (0-500 sccm)
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- O2 (0-500 sccm)
- N2 (0-500 sccm)
- CF4 (0-200 sccm)
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NA
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NA
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| Process power
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10-100 W (10-100%)
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150-1000 W
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150-1000 W
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NA
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NA
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| Process pressure
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0.8 mbar
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0.5-1.5 mbar
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0.5-1.5 mbar
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NA
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NA
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| Process solvent
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NA
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NA
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NA
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- NMP (Remover 1165)
- IPA (rinsing agent)
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- NMP (Remover 1165)
- IPA (rinsing agent)
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| Process temperature
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Up to ~100°C
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Up to ~100°C
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Up to ~100°C
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Up to ~65°C
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Up to ~65°C
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| Process time
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1-10 minutes
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- Stripping: 20-90 minutes
- Descum: 5-15 minutes
- Surface treatment: Seconds to minutes
- Other ashing: Hours, material dependent
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- Stripping: 20-90 minutes
- Descum: 5-15 minutes
- Surface treatment: Seconds to minutes
- Other ashing: Hours, material dependent
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- NMP (Remover 1165)
- IPA (rinsing agent)
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- NMP (Remover 1165)
- IPA (rinsing agent)
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| Substrate batch
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- Chips: several
- 50 mm wafer: several
- 100 mm wafer: 1
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- Chips: several
- 50 mm wafer: several
- 100 mm wafer: 1-25
- 150 mm wafer: 1-25
- 200 mm wafer: 1-25
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- Chips: several
- 50 mm wafer: several
- 100 mm wafer: 1-25
- 150 mm wafer: 1-25
- 200 mm wafer: 1-25
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- 100 mm wafer: 1-25
- 150 mm wafer: 1-25
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- 100 mm wafer: 1-25
- 150 mm wafer: 1-25
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| Substrate materials
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- No polymer substrates
- Silicon substrates
- III-V substrates
- Glass substrates
- Films, or patterned films, of any material except type IV (Pb, Te)
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- No metals
- No metal oxides
- No III-V materials
- Silicon substrates
- Glass substrates
- Polymer substrates
- Films, or patterned films, of resists/polymers
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- Silicon substrates
- III-V substrates (only on Si carrier)
- Glass substrates
- Polymer substrates
- Films, or patterned films, of any material except type IV (Pb, Te)
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- No iron (Fe) containing films
- Silicon substrates
- III-V substrates
- Glass substrates
- Polymer substrates
- Films, or patterned films, of any material except type IV (Pb, Te)
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- No iron (Fe) or Copper (Cu) containing films
- Silicon substrates
- III-V substrates (only if clean)
- Glass substrates
- Films, or patterned films, of any material except type IV (Pb, Te)
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Decommisioned tools
Plasma asher 1 was decommissioned 2024-12-02.
Information about decommissioned tool can be found here.
Plasma asher 2 was decommissioned 2024-12-02.
Information about decommissioned tool can be found here.
