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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
|ItemName= Background knowledge required for safe operation
|ItemName= List of approved recipes
|ItemConfiguration= The users and supervisors of Pegasus-2 must carefully read the 4 papers listed in the comments in order to have a correct understanding of the etch process and experimental procedure and how it relates to the Bosch etch performance.
|ItemConfiguration= The list of currently approved recipes is:
|ItemComment= Papers:
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/barcetchgentle | A barc etch gentle ]]
*[[media:Black silicon on demand.pdf | On the formation of black silicon in SF6-O2 plasma: The clear, oxidize, remove, and etch (CORE) sequence and black silicon on demand]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/barcetchstrip | A barc etch strip ]]
*[[media:The CORE sequence.pdf | The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF<sub>6</sub>/O<sub>2</sub> Cycles with Excellent 3D Profile Control at Room Temperature ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Cretch | Cr etch ]]
*[[media:Ultrahigh aspect ratio etching and Cr mask.pdf | Ultrahigh aspect ratio etching of silicon in SF<sub>6</sub>-O<sub>2</sub> plasma: The clear-oxidize-remove etch (CORE) sequence and chromium mask]]
*[[media:Cr and CrOx etching using SF6 and O2 plasma.pdf | Cr and CrO<sub>x</sub> etching using SF<sub>6</sub> and O2 plasma]]


* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Nanoscale silicon etching with SF6 and O2| The CORE process that has now been renamed to ORE t1 ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/polySietchhardmask | A polySi etch hard mask ]]
|ItemComment=
}}
}}


|}
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=== The recipes in the 'std' folder ===


== Process information ==
== Process information ==