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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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|style="background:WhiteSmoke; color:black" align="center"|700
|style="background:WhiteSmoke; color:black" align="center"|140 (bonded target)


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|style="background:WhiteSmoke; color:black" align="center"|10
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