Specific Process Knowledge/Characterization/Profiler: Difference between revisions
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!style="background:silver; color:black;" align="left"|Posibilities | !style="background:silver; color:black;" align="left"|Posibilities | ||
|style="background:LightGrey; color:black"|Confocal, interferometric and AI focus variation tophography and reflectometry | |style="background:LightGrey; color:black"|Confocal, interferometric and AI focus variation tophography and reflectometry | ||
*Standard microscope imaging | *Standard microscope imaging | ||
*Confocal imaging | *Confocal imaging | ||
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*High resolution thin film thickness measurement using reflectrometry | *High resolution thin film thickness measurement using reflectrometry | ||
*Stitched scans | *Stitched scans | ||
*Wafer mapping | *Wafer mapping | ||
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[[image:Techniques overview.JPG]] | |||
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!style="background:silver; color:black" align="left"|Performance | !style="background:silver; color:black" align="left"|Performance | ||