Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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**AZ MiR | **AZ MiR | ||
**AZ nLOF | **AZ nLOF | ||
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*Coating of E-beam resists | *Coating of E-beam resists | ||
** CSAR, ZEP, PMMA/MMA, HSQ (FOx) | ** CSAR, ZEP, PMMA/MMA, HSQ (FOx) | ||
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* Single substrate | * Single substrate | ||
* Non-vacuum chuck for fragile substrates | * Non-vacuum chuck for fragile substrates | ||
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* Single substrate | * Single substrate | ||
* Edge handling chuck | * Edge handling chuck | ||
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*10 - 5000 rpm (3000 rpm with non-vacuum chuck) | *10 - 5000 rpm (3000 rpm with non-vacuum chuck) | ||
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*100 - 5000 rpm | *100 - 5000 rpm | ||
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*optional (max. speed 3000 rpm) | *optional (max. speed 3000 rpm) | ||
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*no | *no | ||
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*100 mm wafer | *100 mm wafer | ||
*150 mm wafer | *150 mm wafer | ||
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*50 mm wafers | *50 mm wafers | ||
*100 mm wafers | *100 mm wafers | ||
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*1 | *1 | ||
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*1 | *1 | ||
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*All cleanroom materials except III-V materials | *All cleanroom materials except III-V materials | ||
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*Silicon | *Silicon | ||
*III-V materials | *III-V materials | ||