Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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 Spin Coater: Gamma E-beam and UV will be installed at Danchip in June 2017. It is a Gamma 4M cluster from Süss MicroTec with spin coating, vapour priming, and baking modules. The system handles 2", 4", and 6" wafers without size conversion, using two separate coater stations.
+The 2" coater station is equipped with 2 different resists lines:
+*AR-P 6200.09 (CSAR)
+*AZ 5214E
+and
+*1 syringe, which can be used for various resists.
+The 4"/6" coater station is equipped with 3 different resists lines:
+*AR-P 6200.09 (CSAR)
+*AZ 5214E
+*AZ MiR 701
+The processes that are available on the system are developed by Danchip. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
+'''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training video]'''
+<!--'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]''' -->
+=== Equipment performance and process related parameters ===
+{| border="2" cellspacing="0" cellpadding="2"
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+*HMDS priming
+*Spin coating of PGMEA based UV resists
+*Spin coating of E-beam resists <sup>1)</sup>
+*Soft baking
+|-
+!style="background:silver; color:black;" align="center" width="60"|Resist
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+* AZ MiR 701 (29cps)
+* AZ nLOF 2020
+* AZ 5214E
+* 100cc syringe dispense
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
+|style="background:LightGrey; color:black"|HMDS contact angle
+|style="background:WhiteSmoke; color:black" align="center"|
+- 80°
+|-
+|style="background:LightGrey; color:black"|Coating thickness
+|style="background:WhiteSmoke; color:black"|
+* AZ MiR 701: 1.5-4 µm
+* AZ nLOF 2020: 1.5-5 µm
+* AZ 5214E: 1.5-5 µm
+* AZ 4562: 5-15 µm
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters
+|style="background:LightGrey; color:black"|Priming temperature
+|style="background:WhiteSmoke; color:black" align="center"|
+°C
+|-
+|style="background:LightGrey; color:black"|Spin speed
+|style="background:WhiteSmoke; color:black" align="center"|
+- 6000 rpm
+|-
+|style="background:LightGrey; color:black"|Spin acceleration
+|style="background:WhiteSmoke; color:black" align="center"|
+- 10000 rpm/s
+|-
+|style="background:LightGrey; color:black"|Hotplate temperature
+|style="background:WhiteSmoke; color:black" align="center"|
+- 200 °C
+|-
+|style="background:LightGrey; color:black"|Cool plate temperature
+|style="background:WhiteSmoke; color:black" align="center"|
+°C
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Substrate size
+|style="background:WhiteSmoke; color:black"|
+* 50 mm wafers <sup>1)</sup>
+* 100 mm wafers
+* 150 mm wafers
+* 200 mm wafers <sup>1)</sup>
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black" align="center"|
+Silicon and glass
+|-
+|style="background:LightGrey; color:black"|Batch
+|style="background:WhiteSmoke; color:black" align="center"|
+- 25
+|-
+|}
+<sup>1)</sup> Requires tool change.
+<br clear="all" />
 ==Spin Coater: RCD8==