|
|
| Line 238: |
Line 238: |
| *All chemicals to be spray coated must be approved specifically for spray coating | | *All chemicals to be spray coated must be approved specifically for spray coating |
| *Any non-toxic, non-particulate and non-crosslinking material is likely to be approved | | *Any non-toxic, non-particulate and non-crosslinking material is likely to be approved |
| |-
| |
| |}
| |
|
| |
| <br clear="all" />
| |
|
| |
| ==SSE Spinner==
| |
| [[Image:SSEspinner2.jpg|350px|thumb|right|The SSE spinner MAXIMUS: positioned in E-5]]
| |
|
| |
| '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#SSE_Spinner click here]'''
| |
|
| |
| ''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
| |
|
| |
| SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.
| |
|
| |
| The system is equipped with 2 different resists lines:
| |
| *AZ 5214E
| |
| *AZ 4562
| |
| and
| |
| *2 syringe lines, which can be used for spinning of e-beam resist.
| |
|
| |
| '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=188 LabManager]'''
| |
|
| |
| ===Process information===
| |
|
| |
| The typical flow for resist spinning is divided in 3 steps: video, spinning and soft bake.
| |
| You need to create a separate recipe for each station and then collect the recipes in a flow. For the video station we have 3 standard recipes for 3 different wafer sizes: 2inch, 4inch, 6inch. To create a recipe for the coater station you need to describe spinning sequence using the predefined functions. Then you create recipe for the hotplates. After all recipes are created they can be set together in the different flows. It is why we are not recommending the user just change some parameters in the recipe, this change can effect some other flows.
| |
|
| |
| *[[Specific Process Knowledge/Lithography/Coaters/General SSE spinner process information|General SSE spinner process information]]
| |
| *[[Specific Process Knowledge/Lithography/Coaters/SSE Spinner AZ5214e coating|AZ5214E coating on SSE Spinner]]
| |
|
| |
| ''Flow names, process parameters, and test results:''
| |
| *'''_DCH_100mm_AZ5214E_1,5um'''
| |
| Spin-off: 10 s at 2300 rpm closed followed by 10s at 3500 rpm open.
| |
|
| |
| Soft bake: 90 s at 90°C in contact
| |
|
| |
| {|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"
| |
| |-
| |
|
| |
| |-
| |
| |-style="background:silver; color:black"
| |
| !Substrate
| |
| !Thickness
| |
| !Uniformity (+/-)
| |
| !Test date
| |
| !Tester initials
| |
| !Comments
| |
| |-
| |
|
| |
| |-
| |
| |-style="background:WhiteSmoke; color:black"
| |
| |-
| |
| |Silicon with native oxide
| |
| |1,399
| |
| |3,1%
| |
| |28/1 2016
| |
| |chasil
| |
| |with HMDS. Average of 3 wafers
| |
| |-
| |
| |Silicon with native oxide
| |
| |1,418
| |
| |2,5%
| |
| |21/2 2016
| |
| |chasil
| |
| |with HMDS. Average of 3 wafers
| |
| |}
| |
|
| |
| *'''_DCH_100mm_AZ5214E_2,2um'''
| |
| Spin-off: 40 s at 2200 rpm open.
| |
|
| |
| Soft bake: 60 s at 90°C in contact
| |
|
| |
| *'''_DCH_100mm_AZ5214E_1,5um'''
| |
| Spin-off: 60 s at 725 rpm open with exhaust closed followed by 10s at 3500 rpm open.
| |
|
| |
| Soft bake: 90 s at 95°C in 1 mm proximity
| |
|
| |
| <br clear="all" />
| |
|
| |
| === Equipment performance and process related parameters ===
| |
|
| |
| {| border="2" cellspacing="0" cellpadding="2"
| |
|
| |
|
| |
| !style="background:silver; color:black;" align="center" width="60"|Purpose
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black"|
| |
| *Spin coating and soft baking UV sensative resists
| |
| *Spin coating and soft baking E-beam resists
| |
| |-
| |
| !style="background:silver; color:black;" align="center" width="60"|Resist
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| * AZ5214E
| |
| * AZ4562
| |
| * E-beam resists
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
| |
| |style="background:LightGrey; color:black"|Coating thickness
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| * AZ5214E 1-4,2 µm
| |
| * AZ4562 6,2-25 µm
| |
| * E-beam resists 0,1-1 µm
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
| |
| |style="background:LightGrey; color:black"|Spin speed
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 100 - 5000 rpm
| |
| |-
| |
| |style="background:LightGrey; color:black"|Spin acceleration
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 100 - 10000 rpm/s
| |
| |-
| |
| |style="background:LightGrey; color:black"|Hotplate temperature
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| * 90°C for softbaking of AZ5214E resist
| |
| * 100°C for softbaking of AZ4562 resist
| |
| * 110°C for reverse baking of AZ5214E resits
| |
| * 180°C for softbaking of e-beam resits
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
| |
| |style="background:LightGrey; color:black"|Substrate size
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| * 50 mm wafers
| |
| * 100 mm wafers
| |
| * 150 mm wafers
| |
| |-
| |
| | style="background:LightGrey; color:black"|Allowed materials
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| All cleanroom materials except III-V materials
| |
| |-
| |
| |style="background:LightGrey; color:black"|Batch
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 1 - 24
| |
| |- | | |- |
| |} | | |} |
