Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions
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= The Sputter coater 04 (Agar Scientific) = | = The Sputter coater 04 (Agar Scientific) = | ||
[[image: | [[image:IMG_6513.JPG|300x300px|right|thumb|Sputter coater 04 (Agar Scientific) located in the cleanroom Cx1]] | ||
The Sputter coater is used to sputter a thin gold layer on different | The Sputter coater is used to sputter a thin gold layer on different samples up to 100 mm wafers. It is not allowed to use the sputter coater for other purposes. | ||
One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM. | One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM. | ||
The sputter coater consists of a sputter chamber with a gold target and a stage | The sputter coater consists of a sputter chamber with a gold target and a stage. Small samples can be mounted on a SEM pinstub holder (only use the smallest pinstubs) with carbon pads and then placed on one of the small holes. The maximum sample size is a 100 mm wafer. | ||
The machine is controlled by a control panel. The sputter process will be done automatically, but the sputter time can be adjusted. | The machine is controlled by a control panel. The sputter process will be done automatically, but the sputter time can be adjusted. | ||
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Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber. | Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber. | ||
The | The Sputter coater 04 (Agar Scientific) is located in the cleanroom Cx1. | ||
'''The user manual and contact information can be found in LabManager:''' | '''The user manual and contact information can be found in LabManager:''' | ||
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=400 | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=400 Sputter coater 04] | ||
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==Overview of the performance of the Sputter coater | ==Overview of the performance of the Sputter coater 04 (Agar Scientific) and some process related parameters== | ||
{| border="2" cellspacing="0" cellpadding="10" | {| border="2" cellspacing="0" cellpadding="10" | ||