Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions
No edit summary |
|||
Line 142: | Line 142: | ||
!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"| | ||
*Gold sputter coating of different samples | *Gold sputter coating of different samples before SEM characterization | ||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"| | ||
* | *Not measured. The maximum allowed sputter time is 30 s | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Deposition rate | |style="background:LightGrey; color:black"|Deposition rate | ||
Line 152: | Line 152: | ||
*Not measured | *Not measured | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Process pressure | |||
|style="background:LightGrey; color:black"|Process | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *0.01 mbar | ||
|- | |- | ||
|style="background:LightGrey; color:black"| | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"| | ||
* | *Gold sputter coating of different samples before SEM characterization | ||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | ||
Line 169: | Line 168: | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*All | *All samples that are allowed in the SEM Supra 1 | ||
|- | |- | ||
|- | |- | ||
|} | |} |
Revision as of 09:13, 23 September 2016
Feedback to this page: click here
The Hummer Sputter coater
The Hummer sputter coater is used to sputter a thin gold layer on different small samples (up to 100 mm wafers).
One of the most effective ways to counter the problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The Hummer sputter coater is an instrument that allows you to coat small samples with a gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps the gold layer will effectively eliminate all charging problems in the SEM.
The Hummer sputter coater is located in servie area Cx1 in the clearoom.
The user manual and contact information can be found in LabManager:
Process knowledge
Purpose |
| |
---|---|---|
Performance | Film thickness |
|
Deposition rate |
| |
Process parameter range | Process Temperature |
|
Process pressure |
| |
Substrates | Batch size |
|
Allowed materials |
|
The Balzer Sputter coater
The Balzer sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers).
One of the most effective ways to counter the problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The Hummer sputter coater is an instrument that allows you to coat small samples with a gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps the gold layer will effectively eliminate all charging problems in the SEM.
The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Jeol) .
The user manual and contact information can be found in LabManager:
Process knowledge
Purpose |
| |
---|---|---|
Performance | Film thickness |
|
Deposition rate |
| |
Process parameter range | Process Temperature |
|
Process pressure |
| |
Substrates | Batch size |
|
Allowed materials |
|
The Sputter coater 03 (Cressington sputter coater)
The Sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers). Itthe
One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM.
The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Supra 1) .
The user manual and contact information can be found in LabManager:
Process knowledge
Purpose |
| |
---|---|---|
Performance | Film thickness |
|
Deposition rate |
| |
Process pressure |
| |
Purpose |
| |
Substrates | Batch size |
|
Allowed materials |
|