Specific Process Knowledge/Thin film deposition/PECVD: Difference between revisions
Appearance
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|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*1-3 4" wafer per run | |||
*1 6" wafer per run | |||
*Or several smaller pieces | |||
*Deposition on one side of the substrate | |||
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*One 4" wafer per run | *One 4" wafer per run | ||
*One 6" wafer per run | *One 6" wafer per run | ||
*Or several | *Or several smaller pieces on carrier wafer | ||
*Deposition on one side of the substrate | *Deposition on one side of the substrate | ||
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| style="background:LightGrey; color:black"|Materials allowed | | style="background:LightGrey; color:black"|Materials allowed | ||