Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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==Spin Coater: Manual All Resists == | ==Spin Coater: Manual All Resists == | ||
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All cleanroom materials | All cleanroom materials | ||
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|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
1 | |||
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==Spin Coater: Manual All Purpose== | |||
[[Image:IMG 1175.JPG|300x300px|thumb|right|Spin Coater: Manual All Purpose located in fumehood in C-1]] | |||
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Manual_All_Purpose click here]''' | |||
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]'' | |||
Manual Spinner 1, WS-650 model, from Laurell is a resist spinning coater at Danchip which can be used for spinning on whole 2", 4" and 6" substrates and also a small pieces. | |||
The system can be used for spinning all resists, but remember to clean the spinner with an appropriate solvents, which can remove the resist residues. | |||
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=315 LabManager]''' | |||
=== Equipment performance and process related parameters === | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
*Spin coating all resists | |||
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!style="background:silver; color:black;" align="center" width="60"|Resist | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* all approved resists | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | |||
|style="background:LightGrey; color:black"|Coating thickness | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* resist depended | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | |||
|style="background:LightGrey; color:black"|Spin speed | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
100 - 5000 rpm | |||
|- | |||
|style="background:LightGrey; color:black"|Spin acceleration | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
100 - 5000 rpm/s | |||
|- | |||
|style="background:LightGrey; color:black"|Hotplate temperature | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* changeable temperature from 20° to 200° | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
* 50 mm wafers | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
* down to 10x10mm pieces | |||
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| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
All cleanroom materials | |||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||