Specific Process Knowledge/Thermal Process/A4 Phosphor Pre-dep furnace

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Phosphorus Pre-dep furnace (A4)

Phosphorus Pre-dep furnace (A4). Positioned in cleanroom 2

The Phosphorus Pre-dep furnace (A4) is used to dope Si wafers with phosphorus to make conductive structures, etch stop layers etc. The doping source is phosphoryl chloride (commonly called phosphorus oxychloride) which is a colourless liquid with the formula POCl₃.

A4 is the lowest furnace tube in the A-stack positioned in cleanroom 2. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Please be aware of that all wafers have to be RCA cleaned before they enter the furnace, and check the cross contamination information in LabManager before you use the furnace.

The user manual, technical information and contact information can be found in LabManager:

Phosphorus Pre-dep furnace (A4)

Process knowledge

• Dope with Phosphorus

Overview of the performance of the Phosphorus Pre-dep furnace and some process related parameters

Purpose	Phosphorus pre-deposition using POCL3
Process parameter range	Process Temperature	900-1150 oC
	Process pressure	1 atm
	Gasses on the system	POCl3, N2
Substrates	Batch size	1-30 100 mm wafers (or 50 mm wafers) per run
	Substrate materials allowed	Silicon wafers (RCA cleaned)