Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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|Low Presure Chemical Vapor Deposition TEOS gives a good quality SiO2 and is a batch process. | |Low Presure Chemical Vapor Deposition TEOS gives a good quality SiO2 and is a batch process. | ||
|Plasma Enhanced Chemical Vapor Deposition has the advantach that a silicon oxide and be deposited with a quit high deposition rate at a rather low temperature. | |Plasma Enhanced Chemical Vapor Deposition has the advantach that a silicon oxide and be deposited with a quit high deposition rate at a rather low temperature. | ||
|Sputter deposition: can be done ontop of a large range of materials | |Sputter deposition: can be done ontop of a large range of materials. ''Observe: SiO2 Target is not available at the moment, please contact ThinFilm if you are interested in the process. '' | ||
|Sputter deposition: can be done ontop of a large range of materials. This system can only run in depostion mode in certain periods. | |Sputter deposition: can be done ontop of a large range of materials. This system can only run in depostion mode in certain periods. | ||
|Sputter deposition: can be done ontop of a large range of materials | |Sputter deposition: can be done ontop of a large range of materials | ||