Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions

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 |-
 |-style="background:WhiteSmoke; color:black"
-!Substrate size
+!Substrate size / Batch size
 |
 *1-13 100 mm wafers
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 !'''Allowed materials'''
 |
-*Allowed material 1
+*Silicon wafers
-*Allowed material 2
+**with layers of silicon oxide or silicon (oxy)nitride
+*Quartz wafers
 |
-*Allowed material 1
+*Silicon
-*Allowed material 2
+**with layers of silicon oxide or silicon (oxy)nitride
-*Allowed material 3
+*Quartz
+*IIIV materials (in PECVD2)
+*Small amount of metal (in PECVD3)
 |
+*Silicon
+**with layers of silicon oxide or silicon (oxy)nitride
+*Quartz
+*Metals
 |
+*Almost any material
+*not Pb and very poisonous materials
 |-
 |}