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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
2,001 edits
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|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04]]</b>
<!--|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>-->


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*Direct laser writing
*Direct laser writing
OBS: this tool is in PolyFabLab
OBS: this tool is in PolyFabLab
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*UV exposure
*DUV exposure-->


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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
~1 µm
~1 µm
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
±1 µm
±1 µm
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*365nm LED
*365nm LED
*405nm laser diode
*405nm laser diode
<!--|style="background:WhiteSmoke; color:black"|
*1000 W Hg-Xe lamp
*Dichroic mirror:
**Near UV (350-450nm)
**Mid UV (260-320nm)
**Deep UV (220-260nm)-->


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**Optical auto-focus
**Optical auto-focus
**Pneumatic auto-focus
**Pneumatic auto-focus
<!--|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity exposure with home-made chuck and maskholder
*Inclined exposure
*Rotating exposure-->


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*1 100 mm wafer
*1 100 mm wafer
*1 150 mm wafer
*1 150 mm wafer
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*all sizes up to 8inch-->


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*All PolyFabLab materials
*All PolyFabLab materials
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*All cleanroom materials-->
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