Specific Process Knowledge/Lithography/Strip: Difference between revisions
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*Resist stripping | *Resist stripping | ||
*Resist descum | *Resist descum | ||
*Surface treatment | |||
*Other ashing of organic material | |||
| | | | ||
*Resist stripping | *Resist stripping | ||
*Resist descum | *Resist descum | ||
*Surface treatment | |||
*Other ashing of organic material | |||
| Resist stripping | | Resist stripping | ||
| Metal lift-off | | Metal lift-off | ||
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| 150-1000 W | | 150-1000 W | ||
| 150-1000 W | | 150-1000 W | ||
| NA | |||
| NA | |||
|- | |||
! scope=row style="text-align: left;" | Process pressure | |||
| 0.8 mbar | |||
| 0.5-1.5 mbar | |||
| 0.5-1.5 mbar | |||
| NA | | NA | ||
| NA | | NA | ||
| Line 59: | Line 70: | ||
| NA | | NA | ||
| NA | | NA | ||
| | |||
*NMP (Remover 1165) | |||
*IPA (rinsing agent) | |||
| | |||
*NMP (Remover 1165) | |||
*IPA (rinsing agent) | |||
|- | |||
! scope=row style="text-align: left;" | Process time | |||
| 1-10 minutes | |||
| | |||
*Stripping: 20-90 minutes | |||
*Descum: 5-15 minutes | |||
*Surface treatment: Seconds to minutes | |||
*Other ashing: Hours, material dependent | |||
| | |||
*Stripping: 20-90 minutes | |||
*Descum: 5-15 minutes | |||
*Surface treatment: Seconds to minutes | |||
*Other ashing: Hours, material dependent | |||
| | | | ||
*NMP (Remover 1165) | *NMP (Remover 1165) | ||
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<br clear="all" /> | <br clear="all" /> | ||
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= Plasma Ashing process parameters= | = Plasma Ashing process parameters= | ||
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