Specific Process Knowledge/Thin film deposition/ALD Picosun R200: Difference between revisions

<i>As the purpose of ALD 1 is to deposit very thin and uniform layers, the allowed deposition thickness is limited to 100 nm, and it is not allowed to do more depositions on the same sample(s) to deposit thicker layers than 100 nm. The deposition of thicker layers is not allowed, as this would occupy the machine for an extended period, thereby reducing its availability to fewer users. Long depositions also cause issues, and with flakes and particles, this means that the chamber and the pump line will need to be cleaned or replaced quite often. Furthermore, the delivery time on precursors is usually quite long. When creating a sample design, it is advisable to avoid steps that require depositing thicker layers than 100 nm using ALD. Alternatively, consider whether the same material can be deposited using other machines in the cleanroom.</i>