Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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3.) Development of nLOF | 3.) Development of nLOF | ||
'''4.) 5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min) was done right before TiAu deposition''' | |||
5.) 10 nm Ti depositing with 2 A/s by Temescal | 5.) 10 nm Ti depositing with 2 A/s by Temescal | ||
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7.) Lift-off (approx. 45 min) | 7.) Lift-off (approx. 45 min) | ||
By adding step 4.) 5 min Descum, the problem with the delamination of metals was solved. | |||