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Specific Process Knowledge/Lithography/Development: Difference between revisions

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#Dispense puddle while rotating substrate slowly
#Dispense puddle while rotating substrate slowly
#Puddle development while not rotating
#Puddle development while not rotating
#Agitate substrate once per 30 seconds by rotating slowly for 1 second
#Agitate substrate once per 15 seconds by rotating slowly for 1 second
#Spin off developer
#Spin off developer
#Clean substrate and chamber with DI water
#Clean substrate and chamber with DI water
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MP: Multi-puddle
MP: Multi-puddle


*1 Rinse
*01 Rinse
*2 SP 15s
*02 SP 15
*3 SP 30s
*03 SP 30
*4 SP 60s
*04 SP 60
*5 SP 90s
*05 SP 90
*6 SP 120s
*06 SP 120
*7 MP 2x60 s
*07 SP 300
*8 MP 4x60 s
*08 MP 2x60
*9 MP 6x60 s
*09 MP 5x60
 
*91 SP test
<!--
*92 MP test
*DP 2x60s: Double puddle, 2 times 60s. Rinse and dry.
*MP 4x60s: Multiple puddle, 4 times 60s. Rinse and dry.
*SP 120s: Single puddle, 120s. Rinse and dry.
*SP 15s: Single puddle, 15s. Rinse and dry.
*SP 30s: Single puddle, 30s. Rinse and dry.
*SP 60s: Single puddle, 60s. Rinse and dry.
 
'''Utility recipes'''
*UTIL-DR: Dome rinse.
*UTIL-BE: Bottle empty. Nanolab use only.
-->


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Development"