Specific Process Knowledge/Characterization/XRD/XRD SmartLab: Difference between revisions
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* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in GiXRD|Instrumental broading in GiXRD]]. | * Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in GiXRD|Instrumental broading in GiXRD]]. | ||
==θ/2θ X-ray Diffraction== | |||
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in T2T|Instrumental broadening in symmetrical θ/2θ measurements]]. | |||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== |
Latest revision as of 08:39, 31 July 2024
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XRD SmartLab
The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.
The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:
XRD SmartLab in LabManager - requires login
Various measurement types including X-Ray reflectivity, Rocking curve, Theta-2theta, and Pole figures are described here:
The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager:
- (FAT) Factory Acceptance Test - requires login
The same measurement were completed as part of the acceptance, but no report was generated. In addition the inspection certificate is available here:
- (SAT) Site Acceptance Test - requires login
Software for analysis
Please see the Data Analysis section at the main XRD page.
Characterization of thin films using X-ray reflectivity (XRR)
Implementing the XRR method the user can calculate thickness, density, and roughness of the deposited material. The XRR is also widely employed for multilayer stack analysis.
Here are some results available:
- Characterization of e-beam deposited Al thin films.
- Characterization of DC sputtered Al thin films.
- Characterization of ALD deposited Al2O3 and TiO2 ultrathin layers.
- Characterization of Sputtered deposited CrSi bilayer.
- Characterization of Sputtered deposited MgO thin films.
- Characterization of Sputtered deposited Sc thin films.
- Characterization of Sputtered deposited ScN thin films.
Grazing Incidence X-ray Diffraction XRD (GiXRD)
- Evaluation of Instrumental broading in GiXRD.
θ/2θ X-ray Diffraction
- Evaluation of Instrumental broadening in symmetrical θ/2θ measurements.
Equipment | XRD SmartLab | |
---|---|---|
Purpose | Crystal structure analysis and thin film thickness measurement |
|
X-ray generator |
Maximum rated output |
3 kW |
Rated tube voltage |
20 to 45 kV | |
Rated tube current |
2 to 60 mA | |
Type |
Sealed tube | |
Target |
Cu | |
Focus size |
0.4 mm x 8 mm (Line/Point) | |
Goniometer |
Scanning mode |
incident / receiver coupled or independent |
Goniomenter radius |
300 mm | |
Minimum step size |
0.0001° (0.36") | |
Sample stage |
| |
Optics | Incident side |
|
Receiver side |
| |
Substrates | Substrate size |
up to 150 mm wafers; thickness up to 21 mm |
Allowed materials |
All materials allowed in the cleanroom |