Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|'''Lift-off''' | |style="background:WhiteSmoke; color:black"; align="center";|'''Lift-off''' | ||
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!style="background:silver; color:black;" |Purpose | !style="background:silver; color:black;"|Purpose | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Lift-off | *Lift-off of UV or E-beam resist | ||
*Resist strip of wafers with metal | *Resist strip of wafers with metal | ||
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NMP (Remover 1165) | *NMP (Remover 1165) | ||
*Rinse in IPA | |||
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!style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | ||