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Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|'''Lift-off'''
|style="background:WhiteSmoke; color:black"; align="center";|'''Lift-off'''
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!style="background:silver; color:black;" |Purpose  
!style="background:silver; color:black;"|Purpose  
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*Lift-off using UV resists, e.g.
*Lift-off of UV or E-beam resist
** AZ 5214E lift-off
** AZ nLOF lift-off
*Lift-off using e-beam resists, e.g.
** CSAR 62
*Resist strip of wafers with metal
*Resist strip of wafers with metal
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NMP (Remover 1165) / Rinse in IPA
*NMP (Remover 1165)
*Rinse in IPA
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!style="background:silver; color:black" valign="center" rowspan="2"|Process parameters
!style="background:silver; color:black" valign="center" rowspan="2"|Process parameters