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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
Line 279: Line 279:


|-
|-
!style="background:LightGrey; color:black" align="center" valign="center"|Au
!style="background:LightGrey; color:black" align="center" valign="center"|Au (Bonded)


|style="background:WhiteSmoke; color:black" align="center"|100
|style="background:WhiteSmoke; color:black" align="center"|100


|style="background:WhiteSmoke; color:black" align="center"|140 (bonded target)
|style="background:WhiteSmoke; color:black" align="center"|140  


|style="background:WhiteSmoke; color:black" align="center"|10
|style="background:WhiteSmoke; color:black" align="center"|10
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