Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
| Line 78: | Line 78: | ||
=Lift-off process= | =Lift-off process= | ||
[[ | [[File:Lift-off process new.png|thumb|Illustration of the lift-off process.]] | ||
The lift-off process is used to pattern a material that can be deposited as a film on a substrate. The material is patterned by depositing the film on top of a patterned masking material, which is then dissolved, thus leaving only parts of the substrate covered in the material. Although this may in theory be done using any combination of mask and material, the most common is using photoresist as a lift-off mask for metal. | The lift-off process is used to pattern a material that can be deposited as a film on a substrate. The material is patterned by depositing the film on top of a patterned masking material, which is then dissolved, thus leaving only parts of the substrate covered in the material. Although this may in theory be done using any combination of mask and material, the most common is using photoresist as a lift-off mask for metal. | ||